Connectors, Sockets for ICs, Transistors
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- Pitch - Mating
- Contact Finish - Mating
- Contact Finish Thickness - Mating
- Contact Finish - Post
- Contact Material - Mating
- Pitch - Post
- Contact Finish Thickness - Post
- Contact Material - Post
- Series
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- Manufacturer: Aries Electronics
- Series: 518
- Type: SIP
- Features: Open Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 13 (1 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
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- Manufacturer: Aries Electronics
- Series: 57
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Number of Positions or Pins (Grid): 42 (2 x 21)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
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- Manufacturer: Aries Electronics
- Series: 57
- Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Beryllium Copper
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- Manufacturer: Mill-Max Manufacturing Corp.
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 511
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 135 (14 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 614
- Type: PGA
- Features: Carrier, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 124 (14 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 605
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Features: Carrier, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Preci-Dip
- Series: 116
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Elevated, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Material - Post: Brass
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- Manufacturer: Preci-Dip
- Series: 510
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Number of Positions or Pins (Grid): 124 (13 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 29.5µin (0.75µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 510
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 145 (17 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Aries Electronics
- Series: 501
- Type: SIP
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Wire Wrap
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 15 (1 x 15)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 523
- Type: PGA
- Mounting Type: Through Hole
- Termination: Wire Wrap
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 114 (13 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
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- Manufacturer: CNC Tech
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 105°C
- Termination: Solder
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 100.0µin (2.54µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 100.0µin (2.54µm)
- Contact Material - Post: Phosphor Bronze
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 511
- Type: PGA
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 324 (18 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 511
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 223 (18 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
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- Offers in stock:
- 10
- 15
- 50
- 100