Found: 21952
  • CONN IC DIP SOCKET 18POS TIN
    3M
    • Manufacturer: 3M
    • Series: 4800
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -25°C ~ 85°C
    • Termination: Solder
    • Housing Material: Polyester, Glass Filled
    • Number of Positions or Pins (Grid): 18 (2 x 9)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 35.4µin (0.90µm)
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 35.0µin (0.90µm)
    • Contact Material - Post: Phosphor Bronze
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  • CONN SOCKET PGA 145POS GOLD
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 510
    • Type: PGA
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 145 (15 x 15)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Material - Post: Brass Alloy
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  • SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 515
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 145 (15 x 15)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN SOCKET SIP 31POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 508
    • Type: SIP
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Wire Wrap
    • Housing Material: Polyamide (PA46), Nylon 4/6
    • Number of Positions or Pins (Grid): 31 (1 x 31)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass
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  • CONN SOCKET SIP 27POS TIN
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 700 Elevator Strip-Line™
    • Type: SIP
    • Features: Elevated
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 27 (1 x 27)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Phosphor Bronze
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  • SKT IC OPEN LOWPRO
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 115
    • Type: DIP, 0.4" (10.16mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 28 (2 x 14)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN IC SKT DBL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 116
    • Type: DIP, 0.4" (10.16mm) Row Spacing
    • Features: Elevated, Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 22 (2 x 11)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN TRANSIST TO-5 3POS GOLD
    TE Connectivity AMP Connectors
    • Manufacturer: TE Connectivity AMP Connectors
    • Series: 8058
    • Type: Transistor, TO-5
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polytetrafluoroethylene (PTFE)
    • Number of Positions or Pins (Grid): 3 (Round)
    • Contact Finish - Mating: Gold
    • Contact Material - Mating: Beryllium Copper
    • Contact Finish - Post: Gold
    • Contact Material - Post: Brass
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  • CONN SOCKET SIP 7POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 518
    • Type: SIP
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 7 (1 x 7)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass
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  • CONN IC SKT DBL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 115
    • Type: DIP, 0.4" (10.16mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 22 (2 x 11)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 100.0µin (2.54µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • PGA SOCK 88PIN 13X13 SOLDER TL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 510
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 88 (13 x 13)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Material - Post: Brass Alloy
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  • CONN IC DIP SOCKET 40POS GOLD
    Omron Electronics Inc-EMC Div
    • Manufacturer: Omron Electronics Inc-EMC Div
    • Series: XR2
    • Type: DIP, 0.6" (15.24mm) Row Spacing
    • Features: Carrier
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
    • Number of Positions or Pins (Grid): 40 (2 x 20)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 29.5µin (0.75µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 29.5µin (0.75µm)
    • Contact Material - Post: Beryllium Copper
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  • CONN SOCKET SIP 6POS TIN
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 700 Elevator Strip-Line™
    • Type: SIP
    • Features: Elevated
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 6 (1 x 6)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Phosphor Bronze
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  • CONN SKT STRIP
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 317
    • Type: SIP
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 2 (1 x 2)
    • Pitch - Mating: 0.070" (1.78mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.070" (1.78mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN SOCKET SIP 4POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 0517
    • Type: SIP
    • Mounting Type: Through Hole, Right Angle
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 4 (1 x 4)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass
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