• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Series
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List Table
Found: 21952
Partnumber Description Manufacturer
Type
Mounting Type
Features
Termination
Operating Temperature
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Series
32-6572-10 CONN IC DIP SOCKET ZIF 32POS TIN Aries Electronics DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Through Hole Closed Frame Solder Polyphenylene Sulfide (PPS), Glass Filled 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper 57
13-0518-11 CONN SOCKET SIP 13POS GOLD Aries Electronics SIP Through Hole Open Frame Solder Polyamide (PA46), Nylon 4/6, Glass Filled 13 (1 x 13) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass 518
42-3572-10 CONN IC DIP SOCKET ZIF 42POS TIN Aries Electronics DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Through Hole Closed Frame Solder Polyphenylene Sulfide (PPS), Glass Filled 42 (2 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Beryllium Copper 57
15-0501-21 CONN SOCKET SIP 15POS GOLD Aries Electronics SIP Through Hole Wire Wrap -55°C ~ 125°C Polyamide (PA46), Nylon 4/6, Glass Filled 15 (1 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze 501
243-28-1-06 CONN IC DIP SOCKET 28POS TIN CNC Tech DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Solder -40°C ~ 105°C Polybutylene Terephthalate (PBT), Glass Filled 28 (2 x 14) 0.100" (2.54mm) Tin 100.0µin (2.54µm) Tin Phosphor Bronze 0.100" (2.54mm) 100.0µin (2.54µm) Phosphor Bronze
511-91-223-18-095001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 223 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 511
116-43-636-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
511-13-135-14-051003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 135 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 511
614-93-124-14-071012 SKT CARRIER PGA Mill-Max Manufacturing Corp. PGA Through Hole Carrier, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 124 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 614
605-41-632-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp. DIP, 0.6" (15.24mm) Row Spacing Through Hole Carrier, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 605
510-91-145-17-001001 SOCKET SOLDERTAIL 145-PGA Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 145 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper 0.100" (2.54mm) Brass Alloy 510
511-93-324-18-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Closed Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 324 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 511
523-93-114-13-061002 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Wire Wrap Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 114 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 0.100" (2.54mm) 200.0µin (5.08µm) 523
510-83-124-13-041101 CONN SOCKET PGA 124POS GOLD Preci-Dip PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 124 (13 x 13) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin Beryllium Copper 0.100" (2.54mm) Brass 510
116-87-428-41-012101 CONN IC DIP SOCKET 28POS GOLD Preci-Dip DIP, 0.4" (10.16mm) Row Spacing Through Hole Elevated, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 28 (2 x 14) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) Brass 116
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