• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Series
  • 10
  • 15
  • 50
  • 100
List Table
Found: 21952
Partnumber Description Manufacturer
Type
Mounting Type
Features
Termination
Operating Temperature
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Series
69802-444LF CONN SOCKET PLCC 44POS TINLEAD Amphenol ICC (FCI) PLCC Surface Mount Open Frame Solder Polyphenylene Sulfide (PPS), Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin-Lead 150.0µin (3.81µm) Tin-Lead Phosphor Bronze 0.050" (1.27mm) 150.0µin (3.81µm) Phosphor Bronze 69802
36-6501-21 CONN IC DIP SOCKET 36POS GOLD Aries Electronics DIP, 0.6" (15.24mm) Row Spacing Through Hole Closed Frame Wire Wrap -55°C ~ 125°C Polyamide (PA46), Nylon 4/6, Glass Filled 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze 501
08-2820-90 CONN IC DIP SOCKET 8POS GOLD Aries Electronics DIP, 0.2" (5.08mm) Row Spacing Through Hole, Right Angle, Horizontal Closed Frame Solder Polyamide (PA46), Nylon 4/6 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze Vertisockets™ 800
14-0513-11H CONN SOCKET SIP 14POS GOLD Aries Electronics SIP Through Hole Solder Polyamide (PA46), Nylon 4/6, Glass Filled 14 (1 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass 0513
18-7XXXX-10 CONN SOCKET SIP 18POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 18 (1 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
08-3518-10H CONN IC DIP SOCKET 8POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole Open Frame Solder Polyamide (PA46), Nylon 4/6, Glass Filled 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass 518
A48-LCG-T-R CONN IC DIP SOCKET 48POS GOLD Assmann WSW Components DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 105°C Polybutylene Terephthalate (PBT), Glass Filled 48 (2 x 24) 0.100" (2.54mm) Gold Gold 0.100" (2.54mm)
123-13-650-41-001000 CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp. DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 123
117-91-430-41-005000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30 (2 x 15) 0.070" (1.78mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.070" (1.78mm) 200.0µin (5.08µm) Brass Alloy 117
551-90-135-14-051004 CONN HDR SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Solder Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 135 (14 x 14) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 551
116-47-642-41-001000 STANDRD SOLDRTL Mill-Max Manufacturing Corp. DIP, 0.6" (15.24mm) Row Spacing Through Hole Elevated, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 42 (2 x 21) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 116
511-93-088-12-052003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 88 (12 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 511
522-93-145-15-002001 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 145 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 522
614-13-168-17-105001 SKT CARRIER PGA Mill-Max Manufacturing Corp. PGA Through Hole Carrier, Open Frame Solder Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 168 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) 614
612-87-308-41-001101 CONN IC DIP SOCKET 8POS GOLD Preci-Dip DIP, 0.3" (7.62mm) Row Spacing Through Hole Carrier, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 8 (2 x 4) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) Brass 612
  • 10
  • 15
  • 50
  • 100