• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Series
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List Table
Found: 21952
Partnumber Description Manufacturer
Type
Mounting Type
Features
Termination
Operating Temperature
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Series
48-3573-11 CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Through Hole Closed Frame Solder Polyphenylene Sulfide (PPS), Glass Filled 48 (2 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Beryllium Copper 57
08-7445-10 CONN SOCKET SIP 8POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 8 (1 x 8) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
515-91-169-17-101003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 169 (17 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 515
110-99-648-61-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
515-91-076-11-041002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 76 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 515
522-93-135-14-051001 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 135 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 522
110-91-210-41-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.2" (5.08mm) Row Spacing Surface Mount Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 110
523-93-084-11-041001 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Wire Wrap Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 84 (11 x 11) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 0.100" (2.54mm) 200.0µin (5.08µm) 523
110-93-632-61-801000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
126-91-636-41-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Wire Wrap -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 126
110-93-636-61-105000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
114-91-324-41-117000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.3" (7.62mm) Row Spacing Surface Mount Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 114
515-93-179-18-117002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 179 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 515
110-87-318-41-105161 CONN IC DIP SOCKET 18POS GOLD Preci-Dip DIP, 0.3" (7.62mm) Row Spacing Surface Mount Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 18 (2 x 9) 0.100" (2.54mm) Gold Flash Tin Beryllium Copper 0.100" (2.54mm) Brass 110
4-1437538-8 CONN IC DIP SOCKET 64POS GOLD TE Connectivity AMP Connectors DIP, 0.9" (22.86mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 105°C Polyester 64 (2 x 32) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Copper Alloy 0.100" (2.54mm) 800
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