• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Series
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List Table
Found: 21952
Partnumber Description Manufacturer
Type
Mounting Type
Features
Termination
Operating Temperature
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Series
8444-21B1-RK-TP CONN SOCKET PLCC 44POS TIN 3M PLCC Surface Mount Closed Frame Solder -40°C ~ 105°C Polybutylene Terephthalate (PBT), Glass Filled 44 (4 x 11) 0.050" (1.27mm) Tin 160.0µin (4.06µm) Tin Copper Alloy 0.050" (1.27mm) 160.0µin (4.06µm) Copper Alloy 8400
24-6518-10 CONN IC DIP SOCKET 24POS GOLD Aries Electronics DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Solder Polyamide (PA46), Nylon 4/6, Glass Filled 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass 518
14-8825-310C CONN IC DIP SOCKET 14POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole Closed Frame, Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass 8
05-7560-10 CONN SOCKET SIP 5POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 5 (1 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
523-93-324-18-000002 SKT PGA WRAPOST Mill-Max Manufacturing Corp. PGA Through Hole Wire Wrap Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 324 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead 0.100" (2.54mm) 200.0µin (5.08µm) 523
511-13-049-07-000002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Closed Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 49 (7 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 511
116-43-648-61-003000 CONN IC SKT DBL Mill-Max Manufacturing Corp.
111-93-628-41-001000 CONN IC DIP SOCKET 28POS GOLD Mill-Max Manufacturing Corp. DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 111
510-41-181-15-041002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 181 (15 x 15) 0.100" (2.54mm) Beryllium Copper 0.100" (2.54mm) Brass Alloy 510
515-13-223-18-098002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 515
551-90-323-21-005005 CONN HDR SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Solder Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 323 (21 x 21) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Tin-Lead 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 551
551-10-072-11-042005 CONN HDR SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Solder Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 72 (11 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 551
TCC03DKSN-S1713 CONN TRANSIST TO-262 3POS GOLD Sullins Connector Solutions Transistor, TO-262 Through Hole Solder -50°C ~ 175°C Polyphenylene Sulfide (PPS) 3 (Rectangular) 0.150" (3.81mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.150" (3.81mm) 30.0µin (0.76µm) Beryllium Copper
2-1437540-2 CONN IC DIP SOCKET 32POS GOLD TE Connectivity AMP Connectors DIP, 0.6" (15.24mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 105°C Polyester 32 (2 x 16) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Copper Alloy 0.100" (2.54mm) 800
9-1437530-1 510-AG92D-08=INLINE SOCKET TE Connectivity AMP Connectors
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