• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Series
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List Table
Found: 21952
Partnumber Description Manufacturer
Type
Mounting Type
Features
Termination
Operating Temperature
Housing Material
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Finish - Post
Contact Material - Mating
Pitch - Post
Contact Finish Thickness - Post
Contact Material - Post
Series
08-6513-10H CONN IC DIP SOCKET 8POS GOLD Aries Electronics DIP, 0.6" (15.24mm) Row Spacing Through Hole Closed Frame Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Lo-PRO®file, 513
08-822-90C CONN IC DIP SOCKET 8POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole, Right Angle, Horizontal Closed Frame Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Vertisockets™ 800
20-8400-310C CONN IC DIP SOCKET 20POS GOLD Aries Electronics DIP, 0.3" (7.62mm) Row Spacing Through Hole Closed Frame, Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass 8
20-0501-21 CONN SOCKET SIP 20POS GOLD Aries Electronics SIP Through Hole Wire Wrap -55°C ~ 125°C Polyamide (PA46), Nylon 4/6, Glass Filled 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold Phosphor Bronze 0.100" (2.54mm) 10.0µin (0.25µm) Phosphor Bronze 501
20-7453-10 CONN SOCKET SIP 20POS TIN Aries Electronics SIP Through Hole Elevated Solder -55°C ~ 105°C Polyamide (PA46), Nylon 4/6, Glass Filled 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin Phosphor Bronze 0.100" (2.54mm) 200.0µin (5.08µm) Phosphor Bronze 700 Elevator Strip-Line™
515-93-209-17-081001 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 209 (17 x 17) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 515
511-93-085-13-081003 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 85 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 511
605-91-964-11-480000 SKT CARRIER LOWPRO Mill-Max Manufacturing Corp. DIP, 0.9" (22.86mm) Row Spacing Through Hole Carrier, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 605
551-10-223-18-095003 CONN HDR SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Solder Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 223 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 551
111-41-420-41-001000 CONN IC SKT DBL Mill-Max Manufacturing Corp. DIP, 0.4" (10.16mm) Row Spacing Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) Brass Alloy 111
515-13-223-18-095002 SKT PGA SOLDRTL Mill-Max Manufacturing Corp. PGA Through Hole Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 223 (18 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold Beryllium Copper 0.100" (2.54mm) 10.0µin (0.25µm) Brass Alloy 515
614-93-299-20-096001 SKT CARRIER PGA Mill-Max Manufacturing Corp. PGA Through Hole Carrier, Open Frame Solder Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 299 (20 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin-Lead Beryllium Copper 0.100" (2.54mm) 200.0µin (5.08µm) 614
116-83-422-41-018101 CONN IC DIP SOCKET 22POS GOLD Preci-Dip DIP, 0.4" (10.16mm) Row Spacing Through Hole Elevated, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin Beryllium Copper 0.100" (2.54mm) Brass 116
612-83-432-41-001101 CONN IC DIP SOCKET 32POS GOLD Preci-Dip DIP, 0.4" (10.16mm) Row Spacing Through Hole Carrier, Open Frame Solder -55°C ~ 125°C Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Tin Beryllium Copper 0.100" (2.54mm) Brass 612
2-5916783-7 CONN SOCKET PGA ZIF 370POS GOLD TE Connectivity AMP Connectors PGA, ZIF (ZIP) Through Hole Open Frame Solder Liquid Crystal Polymer (LCP) 370 (19 x 19) 0.100" (2.54mm) Gold Flash Gold Copper Alloy 0.100" (2.54mm) Flash Copper Alloy
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