• Current - Collector (Ic) (Max)
  • Voltage - Collector Emitter Breakdown (Max)
  • Power - Max
Found: 69
  • IGBT 600V 110A 284W TO247
    STMicroelectronics
    • Manufacturer: STMicroelectronics
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 150°C (TJ)
    • Package / Case: TO-247-3
    • Supplier Device Package: TO-247-3
    • Reverse Recovery Time (trr): 67ns
    • Power - Max: 284W
    • Input Type: Standard
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 600V
    • Test Condition: 400V, 30A, 10Ohm, 15V
    • Vce(on) (Max) @ Vge, Ic: 1.45V @ 15V, 30A
    • Current - Collector Pulsed (Icm): 130A
    • Switching Energy: 250µJ (on), 4.2mJ (off)
    • Gate Charge: 200nC
    • Td (on/off) @ 25°C: 50ns/220ns
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  • DISC IGBT XPT-GENX4 TO-247AD
    IXYS
    • Manufacturer: IXYS
    • Series: XPT™, GenX4™
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 175°C (TJ)
    • Package / Case: TO-247-3
    • Supplier Device Package: TO-247 (IXTH)
    • Reverse Recovery Time (trr): 62ns
    • Power - Max: 455W
    • Input Type: Standard
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 650V
    • Test Condition: 400V, 40A, 5Ohm, 15V
    • IGBT Type: PT
    • Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 40A
    • Current - Collector Pulsed (Icm): 215A
    • Switching Energy: 1.6mJ (on), 420µJ (off)
    • Gate Charge: 68nC
    • Td (on/off) @ 25°C: 20ns/100ns
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  • IGBT 600V 110A 446W TO247
    Microchip Technology
    • Manufacturer: Microchip Technology
    • Series: Thunderbolt IGBT®
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 150°C (TJ)
    • Package / Case: TO-247-3
    • Supplier Device Package: TO-247 [B]
    • Power - Max: 446W
    • Input Type: Standard
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 600V
    • Test Condition: 400V, 50A, 4.3Ohm, 15V
    • IGBT Type: NPT
    • Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 50A
    • Current - Collector Pulsed (Icm): 150A
    • Switching Energy: 995µJ (on), 1070µJ (off)
    • Gate Charge: 240nC
    • Td (on/off) @ 25°C: 14ns/240ns
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  • IGBT MODULE 1200V 110A 357W SP4
    Microchip Technology
    • Manufacturer: Microchip Technology
    • Mounting Type: Chassis Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: SP4
    • Supplier Device Package: SP4
    • Configuration: Single
    • Power - Max: 357W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 250µA
    • Input: Standard
    • IGBT Type: Trench Field Stop
    • Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 75A
    • Input Capacitance (Cies) @ Vce: 5.34nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT MODULE 1200V 110A 357W SP3
    Microsemi Corporation
    • Manufacturer: Microsemi Corporation
    • Mounting Type: Chassis Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: SP3
    • Supplier Device Package: SP3
    • Configuration: Asymmetrical Bridge
    • Power - Max: 357W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 250µA
    • Input: Standard
    • IGBT Type: Trench Field Stop
    • Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 75A
    • Input Capacitance (Cies) @ Vce: 5.34nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT MODULE 1200V 110A 385W SP1
    Microsemi Corporation
    • Manufacturer: Microsemi Corporation
    • Mounting Type: Chassis Mount
    • Operating Temperature: -40°C ~ 175°C (TJ)
    • Package / Case: SP1
    • Supplier Device Package: SP1
    • Configuration: Single
    • Power - Max: 385W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 250µA
    • Input: Standard
    • IGBT Type: Trench Field Stop
    • Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
    • Input Capacitance (Cies) @ Vce: 4.4nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT MODULE 1200V 110A 385W SP3
    Microchip Technology
    • Manufacturer: Microchip Technology
    • Mounting Type: Chassis Mount
    • Operating Temperature: -40°C ~ 175°C (TJ)
    • Package / Case: SP3
    • Supplier Device Package: SP3
    • Configuration: Full Bridge
    • Power - Max: 385W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 250µA
    • Input: Standard
    • IGBT Type: Trench Field Stop
    • Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 75A
    • Input Capacitance (Cies) @ Vce: 4.4nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT 300V 110A 255W D2PAK
    Infineon Technologies
    • Manufacturer: Infineon Technologies
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
    • Supplier Device Package: D2PAK
    • Power - Max: 255W
    • Input Type: Standard
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 300V
    • Test Condition: 180V, 35A, 10Ohm
    • IGBT Type: Trench
    • Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 110A
    • Gate Charge: 132nC
    • Td (on/off) @ 25°C: 44ns/245ns
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  • IGBT MODULE 600V 110A 416W SP1
    Microsemi Corporation
    • Manufacturer: Microsemi Corporation
    • Mounting Type: Chassis Mount
    • Package / Case: SP1
    • Supplier Device Package: SP1
    • Configuration: Single
    • Power - Max: 416W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 600V
    • Current - Collector Cutoff (Max): 250µA
    • Input: Standard
    • IGBT Type: NPT
    • Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 100A
    • Input Capacitance (Cies) @ Vce: 4.3nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT 600V 110A 446W TO247
    Microsemi Corporation
    • Manufacturer: Microsemi Corporation
    • Series: Thunderbolt IGBT®
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 150°C (TJ)
    • Package / Case: TO-247-3
    • Supplier Device Package: TO-247 [B]
    • Reverse Recovery Time (trr): 22ns
    • Power - Max: 446W
    • Input Type: Standard
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 600V
    • Test Condition: 400V, 50A, 5Ohm, 15V
    • IGBT Type: NPT
    • Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 50A
    • Current - Collector Pulsed (Icm): 150A
    • Switching Energy: 995µJ (on), 1070µJ (off)
    • Gate Charge: 240nC
    • Td (on/off) @ 25°C: 14ns/240ns
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  • IGBT 1700V 110A 1040W PLUS247
    IXYS
    • Manufacturer: IXYS
    • Series: BIMOSFET™
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 150°C (TJ)
    • Package / Case: TO-247-3 Variant
    • Supplier Device Package: PLUS247™-3
    • Reverse Recovery Time (trr): 360ns
    • Power - Max: 1040W
    • Input Type: Standard
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1700V
    • Test Condition: 1360V, 42A, 1Ohm, 15V
    • Vce(on) (Max) @ Vge, Ic: 6V @ 15V, 42A
    • Current - Collector Pulsed (Icm): 300A
    • Switching Energy: 3.8mJ (off)
    • Gate Charge: 358nC
    • Td (on/off) @ 25°C: 26ns/418ns
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  • IGBT MODULE 1200V 110A 355W E2
    IXYS
    • Manufacturer: IXYS
    • Mounting Type: Chassis Mount
    • Operating Temperature: -40°C ~ 125°C (TJ)
    • Package / Case: E2
    • Supplier Device Package: E2
    • Configuration: Three Phase Inverter
    • Power - Max: 355W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 4mA
    • Input: Standard
    • IGBT Type: Trench
    • Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
    • Input Capacitance (Cies) @ Vce: 5.35nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT MOD 1200V 110A 500W SOT227B
    IXYS
    • Manufacturer: IXYS
    • Mounting Type: Chassis Mount
    • Operating Temperature: -55°C ~ 150°C (TJ)
    • Package / Case: SOT-227-4, miniBLOC
    • Supplier Device Package: SOT-227B
    • Configuration: Single
    • Power - Max: 500W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 1mA
    • Input: Standard
    • Vce(on) (Max) @ Vge, Ic: 4V @ 15V, 55A
    • Input Capacitance (Cies) @ Vce: 8nF @ 25V
    • NTC Thermistor: No
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  • PM-IGBT-SBD-BL2
    Microchip Technology
    • Manufacturer: Microchip Technology
    • Mounting Type: Chassis Mount
    • Operating Temperature: -55°C ~ 175°C (TJ)
    • Package / Case: Module
    • Configuration: Asymmetrical Bridge
    • Power - Max: 375W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 25µA
    • Input: Standard
    • Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 50A
    • Input Capacitance (Cies) @ Vce: 2.77nF @ 25V
    • NTC Thermistor: Yes
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  • IGBT MODULE 1200V 110A 357W SP4
    Microsemi Corporation
    • Manufacturer: Microsemi Corporation
    • Mounting Type: Chassis Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: SP4
    • Supplier Device Package: SP4
    • Configuration: Full Bridge Inverter
    • Power - Max: 357W
    • Current - Collector (Ic) (Max): 110A
    • Voltage - Collector Emitter Breakdown (Max): 1200V
    • Current - Collector Cutoff (Max): 250µA
    • Input: Standard
    • IGBT Type: Trench Field Stop
    • Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 75A
    • Input Capacitance (Cies) @ Vce: 5.34nF @ 25V
    • NTC Thermistor: Yes
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