Semiconductors, Diodes Microchip Technology Chip

- Configuration
- Technology
- Operating Temperature
- Speed
- Power - Max
- Voltage - Zener (Nom) (Vz)
- Impedance (Max) (Zzt)
- Current - Reverse Leakage @ Vr
- Current - Max
- Capacitance @ Vr, F
- Voltage - Forward (Vf) (Max) @ If
- Power Dissipation (Max)
- Resistance @ If, F
- Capacitance Ratio
- Voltage - DC Reverse (Vr) (Max)
- Reverse Recovery Time (trr)
- Operating Temperature - Junction
- Diode Configuration
- Capacitance Ratio Condition
- Q @ Vr, F
- Current - Average Rectified (Io) (per Diode)
- Series

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List Table

Found: 274

MV39003-P2715

GAAS TVAR NON HERMETIC FLIP CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 0.6pF @ 4V, 1MHz
- Voltage - Peak Reverse (Max): 18V
- Capacitance Ratio: 5.6
- Capacitance Ratio Condition: C2/C12
- Q @ Vr, F: 3500 @ 4V, 50MHz
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GC4731-150A-AP

SI LIMITER NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Operating Temperature: -55°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: PIN - Single
- Capacitance @ Vr, F: 0.1pF @ 6V, 1MHz
- Power Dissipation (Max): 2W
- Voltage - Peak Reverse (Max): 15V
- Resistance @ If, F: 2Ohm @ 10mA, 100MHz
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GC9702-00

SI SCHOTTKY NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Schottky
- Voltage - DC Reverse (Vr) (Max): 20V
- Current - Average Rectified (Io): 35mA (DC)
- Voltage - Forward (Vf) (Max) @ If: 430mV @ 1mA
- Speed: Small Signal =< 200mA (Io), Any Speed
- Current - Reverse Leakage @ Vr: 300 nA @ 15 V
- Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
- Operating Temperature - Junction: -55°C ~ 150°C
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KV1501-154-0

SI TVAR NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 200°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 10.6pF @ 10V, 1MHz
- Voltage - Peak Reverse (Max): 12V
- Capacitance Ratio: 17.5
- Capacitance Ratio Condition: C2/C10
- Q @ Vr, F: 130 @ 2V, 10MHz
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MP61007-P00

GAAS PIN NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Operating Temperature: -55°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: PIN - Single
- Capacitance @ Vr, F: 0.1pF @ 10V, 1MHz
- Current - Max: 50mA
- Voltage - Peak Reverse (Max): 75V
- Resistance @ If, F: 2Ohm @ 20mA, 1GHz
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GC4702-00

SI LIMITER NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Operating Temperature: -55°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: PIN - Single
- Capacitance @ Vr, F: 0.3pF @ 6V, 1MHz
- Power Dissipation (Max): 3W
- Voltage - Peak Reverse (Max): 20V
- Resistance @ If, F: 1.2Ohm @ 10mA, 100MHz
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GC4701-00

SI LIMITER NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Operating Temperature: -55°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: PIN - Single
- Capacitance @ Vr, F: 0.15pF @ 6V, 1MHz
- Power Dissipation (Max): 2W
- Voltage - Peak Reverse (Max): 20V
- Resistance @ If, F: 1.5Ohm @ 10mA, 100MHz
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KV1923A-150C

SI TVAR NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 3.2pF @ 8V, 1MHz
- Voltage - Peak Reverse (Max): 12V
- Q @ Vr, F: 600 @ 4V, 50MHz
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GC4741-150A

SI LIMITER NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Operating Temperature: -55°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: PIN - Single
- Capacitance @ Vr, F: 0.1pF @ 6V, 1MHz
- Power Dissipation (Max): 3W
- Voltage - Peak Reverse (Max): 30V
- Resistance @ If, F: 2Ohm @ 10mA, 100MHz
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GC4371-00

SI NIP NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Operating Temperature: -55°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: PIN - Single
- Capacitance @ Vr, F: 0.1pF @ 10V, 1MHz
- Voltage - Peak Reverse (Max): 70V
- Resistance @ If, F: 900mOhm @ 20mA, 1GHz
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MV21009-150A

GAAS TVAR NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 1.8pF @ 4V, 1MHz
- Voltage - Peak Reverse (Max): 30V
- Capacitance Ratio: 4.5
- Capacitance Ratio Condition: C0/C30
- Q @ Vr, F: 5000 @ 4V, 50MHz
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KV2151-00

SI TVAR NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 150°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 1.1pF @ 20V, 1MHz
- Voltage - Peak Reverse (Max): 22V
- Capacitance Ratio: 5
- Capacitance Ratio Condition: C4/C20
- Q @ Vr, F: 600 @ 4V, 50MHz
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GC15009-450A

SI TVAR NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 0.9pF @ 20V, 1MHz
- Voltage - Peak Reverse (Max): 22V
- Capacitance Ratio: 13
- Capacitance Ratio Condition: C0/C20
- Q @ Vr, F: 800 @ 4V, 50MHz
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KV1993A-150A/TR

SI TVAR NON HERMETIC EPSM SMT

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 0.35pF @ 8V, 1MHz
- Voltage - Peak Reverse (Max): 12V
- Q @ Vr, F: 1800 @ 4V, 50MHz
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MV34001-P00

GAAS TVAR NON HERMETIC CHIP

Microchip Technology
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Chip
- Diode Type: Single
- Capacitance @ Vr, F: 0.5pF @ 4V, 1MHz
- Voltage - Peak Reverse (Max): 15V
- Capacitance Ratio: 4.5
- Capacitance Ratio Condition: C2/C12
- Q @ Vr, F: 3000 @ 4V, 50MHz
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