-
- Configuration
- Technology
- Operating Temperature
- Speed
- Power - Max
- Voltage - Zener (Nom) (Vz)
- Impedance (Max) (Zzt)
- Current - Reverse Leakage @ Vr
- Current - Max
- Capacitance @ Vr, F
- Voltage - Forward (Vf) (Max) @ If
- Power Dissipation (Max)
- Resistance @ If, F
- Capacitance Ratio
- Voltage - DC Reverse (Vr) (Max)
- Reverse Recovery Time (trr)
- Operating Temperature - Junction
- Diode Configuration
- Capacitance Ratio Condition
- Q @ Vr, F
- Current - Average Rectified (Io) (per Diode)
- Series
Partnumber | Description | Manufacturer
|
Package / Case
|
Voltage - Peak Reverse (Max)
|
Current - Average Rectified (Io)
|
Diode Type
|
Mounting Type
|
Supplier Device Package
|
Operating Temperature
|
Speed
|
Current - Reverse Leakage @ Vr
|
Current - Max
|
Capacitance @ Vr, F
|
Voltage - Forward (Vf) (Max) @ If
|
Power Dissipation (Max)
|
Resistance @ If, F
|
Capacitance Ratio
|
Voltage - DC Reverse (Vr) (Max)
|
Operating Temperature - Junction
|
Capacitance Ratio Condition
|
Q @ Vr, F
|
Series
|
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
MV31021-150A | GAAS TVAR NON HERMETIC EPSM SMT | Microchip Technology | Die | 22V | Single | Surface Mount | Chip | -55°C ~ 175°C | 3.7pF @ 4V, 1MHz | 11.5 | C2/C20 | 2000 @ 4V, 50MHz | ||||||||||
GC4311-01 | SI NIP NON HERMETIC CHIP W LEAD | Microchip Technology | Die | 100V | PIN - Single | Chip | -55°C ~ 150°C | 0.1pF @ 10V, 1MHz | 1Ohm @ 20mA, 1GHz | |||||||||||||
LSP1005-154-8/TR | SI PIN NON HERMETIC EPSM SMT | Microchip Technology | Die | 50V | PIN - Single | Chip | -55°C ~ 125°C | 5 mA | 0.4pF @ 50V, 1MHz | 250mW | 6.5Ohm @ 5mA, 100MHz | |||||||||||
GC4531-01 | SI NIP NON HERMETIC CHIP W LEAD | Microchip Technology | Die | 300V | PIN - Single | Chip | -55°C ~ 150°C | 0.25pF @ 50V, 1MHz | 1.2Ohm @ 100mA, 100MHz | |||||||||||||
MV21010-190 | GAAS TVAR NON HERMETIC MICROSTRI | Microchip Technology | Die | 30V | Single | Surface Mount | Chip | -55°C ~ 175°C | 2.2pF @ 4V, 1MHz | 4.6 | C0/C30 | 4000 @ 4V, 50MHz | ||||||||||
MS8250-P2920 | GAAS SCHOTTKY NON HERMETIC FLIP | Microchip Technology | Die | 3V | Schottky - Anti-Parallel | Chip | -55°C ~ 125°C | 15mA | 80pF @ 0V, 1MHz | 7Ohm @ 10mA, 100MHz | ||||||||||||
MV20010-190 | GAAS TVAR NON HERMETIC MICROSTRI | Microchip Technology | Die | 15V | Single | Surface Mount | Chip | -55°C ~ 175°C | 2.2pF @ 4V, 1MHz | 3.4 | C0/C15 | 4000 @ 4V, 50MHz | ||||||||||
MV30011-P00 | GAAS TVAR NON HERMETIC CHIP | Microchip Technology | Die | 22V | Single | Surface Mount | Chip | -55°C ~ 175°C | 0.6pF @ 4V, 1MHz | 3.9 | C2/C20 | 4000 @ 4V, 50MHz | ||||||||||
GC4491-150A | SI PIN NON HERMETIC EPSM SMT | Microchip Technology | Die | 750V | PIN - Single | Chip | -55°C ~ 150°C | 50mA | 0.25pF @ 50V, 1MHz | 1.2Ohm @ 100mA, 100MHz | ||||||||||||
GC9701-00 | SI SCHOTTKY NON HERMETIC CHIP | Microchip Technology | Die | 50mA (DC) | Schottky | Surface Mount | Chip | Small Signal =< 200mA (Io), Any Speed | 100nA @ 25V | 1.5pF @ 0V, 1MHz | 430mV @ 1mA | 30V | -55°C ~ 150°C | |||||||||
KV2113-154-4 | SI TVAR NON HERMETIC EPSM SMT | Microchip Technology | Die | 22V | Single | Surface Mount | Chip | -55°C ~ 125°C | 0.45pF @ 20V, 1MHz | 1200 @ 4V, 50MHz | ||||||||||||
GC4430-00 | SI PIN NON HERMETIC CHIP | Microchip Technology | Die | 300V | PIN - Single | Chip | -55°C ~ 150°C | 50mA | 0.1pF @ 50V, 1MHz | 1.5Ohm @ 100mA, 100MHz | ||||||||||||
GC41873-012S | SI PIN NON HERMETIC CHIP | Microchip Technology | Die | 80V | PIN - 1 Pair Series Connection | Chip | -55°C ~ 150°C | 0.02pF @ 50V, 1MHz | 2.5Ohm @ 100mA, 1GHz | |||||||||||||
MV31024-150A | GAAS TVAR NON HERMETIC EPSM SMT | Microchip Technology | Die | 22V | Single | Surface Mount | Chip | -55°C ~ 175°C | 6.8pF @ 4V, 1MHz | 12.6 | C2/C20 | 1500 @ 4V, 50MHz | ||||||||||
MS8150-6498 | GAAS SCHOTTKY NON HERMETIC FLIP | Microchip Technology | Die | Chip |
- 10
- 15
- 50
- 100