Semiconductors, IC's, Memory *size* 128Mb (8M x 16)
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- Operating Temperature
- Supplier Device Package
- Package / Case
- Access Time
- Memory Interface
- Write Cycle Time - Word, Page
- Series
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- Manufacturer: ISSI, Integrated Silicon Solution Inc
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 60-TFBGA
- Supplier Device Package: 60-TFBGA (8x10)
- Voltage - Supply: 1.7V ~ 1.95V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM - Mobile LPDDR
- Memory Type: Volatile
- Clock Frequency: 166MHz
- Access Time: 5.5ns
- Memory Format: DRAM
- Write Cycle Time - Word, Page: 15ns
- Memory Interface: Parallel
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- Manufacturer: Cypress Semiconductor Corp
- Series: GL-S
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-LBGA
- Supplier Device Package: 64-FBGA (9x9)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: FLASH - NOR
- Memory Type: Non-Volatile
- Access Time: 100ns
- Memory Format: FLASH
- Write Cycle Time - Word, Page: 60ns
- Memory Interface: Parallel
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- Manufacturer: Spansion
- Series: Automotive, AEC-Q100, GL-S
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-LBGA
- Supplier Device Package: 64-FBGA (9x9)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: FLASH - NOR
- Memory Type: Non-Volatile
- Access Time: 100ns
- Memory Format: FLASH
- Write Cycle Time - Word, Page: 60ns
- Memory Interface: Parallel
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- Manufacturer: ISSI, Integrated Silicon Solution Inc
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 54-TFBGA
- Supplier Device Package: 54-TFBGA (8x8)
- Voltage - Supply: 3V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM
- Memory Type: Volatile
- Clock Frequency: 166MHz
- Access Time: 5.4ns
- Memory Format: DRAM
- Memory Interface: Parallel
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- Manufacturer: ISSI, Integrated Silicon Solution Inc
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 54-TFBGA
- Supplier Device Package: 54-TFBGA (8x8)
- Voltage - Supply: 3V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM
- Memory Type: Volatile
- Clock Frequency: 143MHz
- Access Time: 5.4ns
- Memory Format: DRAM
- Memory Interface: Parallel
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- Manufacturer: ISSI, Integrated Silicon Solution Inc
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 54-TSOP (0.400", 10.16mm Width)
- Supplier Device Package: 54-TSOP II
- Voltage - Supply: 3V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM
- Memory Type: Volatile
- Clock Frequency: 166MHz
- Access Time: 5.4ns
- Memory Format: DRAM
- Memory Interface: Parallel
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- Manufacturer: Cypress Semiconductor Corp
- Series: GL-S
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: Die
- Supplier Device Package: Wafer
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: FLASH - NOR
- Memory Type: Non-Volatile
- Access Time: 100ns
- Memory Format: FLASH
- Write Cycle Time - Word, Page: 60ns
- Memory Interface: Parallel
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- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 54-VFBGA
- Supplier Device Package: 54-VFBGA (8x8)
- Voltage - Supply: 3V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM - Mobile LPSDR
- Memory Type: Volatile
- Clock Frequency: 100MHz
- Access Time: 7ns
- Memory Format: DRAM
- Write Cycle Time - Word, Page: 15ns
- Memory Interface: Parallel
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- Manufacturer: Cypress Semiconductor Corp
- Series: GL-S
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 56-TFSOP (0.724", 18.40mm Width)
- Supplier Device Package: 56-TSOP
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: FLASH - NOR
- Memory Type: Non-Volatile
- Access Time: 90ns
- Memory Format: FLASH
- Write Cycle Time - Word, Page: 60ns
- Memory Interface: Parallel
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- Manufacturer: ISSI, Integrated Silicon Solution Inc
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 54-TSOP (0.400", 10.16mm Width)
- Supplier Device Package: 54-TSOP II
- Voltage - Supply: 3V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM
- Memory Type: Volatile
- Clock Frequency: 166MHz
- Access Time: 5.4ns
- Memory Format: DRAM
- Memory Interface: Parallel
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- Manufacturer: Cypress Semiconductor Corp
- Series: GL-S
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 56-VFBGA
- Supplier Device Package: 56-FBGA (9x7)
- Voltage - Supply: 1.65V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: FLASH - NOR
- Memory Type: Non-Volatile
- Access Time: 100ns
- Memory Format: FLASH
- Write Cycle Time - Word, Page: 60ns
- Memory Interface: Parallel
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- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 60-VFBGA
- Supplier Device Package: 60-VFBGA (8x10)
- Voltage - Supply: 1.7V ~ 1.9V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM - Mobile LPDDR
- Memory Type: Volatile
- Clock Frequency: 104MHz
- Access Time: 7ns
- Memory Format: DRAM
- Write Cycle Time - Word, Page: 15ns
- Memory Interface: Parallel
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- Manufacturer: ISSI, Integrated Silicon Solution Inc
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 54-TFBGA
- Supplier Device Package: 54-TFBGA (8x8)
- Voltage - Supply: 3V ~ 3.6V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM
- Memory Type: Volatile
- Clock Frequency: 166MHz
- Access Time: 5.4ns
- Memory Format: DRAM
- Memory Interface: Parallel
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- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 54-VFBGA
- Supplier Device Package: 54-VFBGA (8x8)
- Voltage - Supply: 2.3V ~ 2.7V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM - Mobile LPSDR
- Memory Type: Volatile
- Clock Frequency: 125MHz
- Access Time: 7ns
- Memory Format: DRAM
- Write Cycle Time - Word, Page: 15ns
- Memory Interface: Parallel
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- Manufacturer: Winbond Electronics
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 66-TSSOP (0.400", 10.16mm Width)
- Supplier Device Package: 66-TSOP II
- Voltage - Supply: 2.3V ~ 2.7V
- Memory Size: 128Mb (8M x 16)
- Technology: SDRAM - DDR
- Memory Type: Volatile
- Clock Frequency: 200MHz
- Access Time: 50ns
- Memory Format: DRAM
- Write Cycle Time - Word, Page: 15ns
- Memory Interface: Parallel
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- Offers in stock:
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