• Manufacturer: Central Semiconductor Corp
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1V @ 100mA
• Current - Reverse Leakage @ Vr: 100nA @ 1V
• Tolerance: ±5.88%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 5.1V
• Impedance (Max) (Zzt): 35 Ohms

• Manufacturer: Central Semiconductor Corp
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 150°C (TJ)
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1V @ 100mA
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 5.1V

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 16.7V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 22V
• Impedance (Max) (Zzt): 23 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 21V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 28V
• Impedance (Max) (Zzt): 44 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 47V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 62V
• Impedance (Max) (Zzt): 185 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 21.28V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 28V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 100°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±5%
• Voltage - Zener (Nom) (Vz): 6.4V
• Impedance (Max) (Zzt): 50 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 29.7V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 39V
• Impedance (Max) (Zzt): 60 Ohms

• Manufacturer: SMC Diode Solutions
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 165°C (TJ)
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 12.2V
• Tolerance: ±5%
• Power - Max: 3W
• Voltage - Zener (Nom) (Vz): 16V
• Impedance (Max) (Zzt): 10 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 51.68V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 68V
• Impedance (Max) (Zzt): 700 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 7V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 9.1V
• Impedance (Max) (Zzt): 10 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±4.83%
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 10 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 21V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 27V
• Impedance (Max) (Zzt): 41 Ohms