RF Misc ICs and Modules, RFI and EMI - Contacts, Fingerstock and Gaskets Film Over Foam
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- Plating
- Thickness - Overall
- Adhesive
- Plating - Thickness
- Attachment Method
- Series
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- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.118" (3.00mm)
- Width: 0.157" (4.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.138" (3.50mm)
- Shape: Rectangle
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
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- Offers in stock:
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- Manufacturer: Leader Tech Inc.
- Type: Film Over Foam
- Length: 0.315" (8.00mm)
- Width: 0.354" (9.00mm)
- Height: 0.236" (6.00mm)
- Shape: Rectangle
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Leader Tech Inc.
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.256" (6.50mm)
- Width: 0.197" (5.00mm)
- Height: 0.118" (3.00mm)
- Shape: Rectangle
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.098" (2.50mm)
- Width: 0.197" (5.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.197" (5.00mm)
- Shape: Hourglass
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Leader Tech Inc.
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.197" (5.00mm)
- Width: 0.157" (4.00mm)
- Height: 0.118" (3.00mm)
- Shape: Rectangle
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.197" (5.00mm)
- Width: 0.197" (5.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.197" (5.00mm)
- Shape: Hourglass
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.098" (2.50mm)
- Width: 0.157" (4.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.157" (4.00mm)
- Shape: Rectangle
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.118" (3.00mm)
- Width: 0.197" (5.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.197" (5.00mm)
- Shape: Hourglass
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Leader Tech Inc.
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.157" (4.00mm)
- Width: 0.295" (7.49mm)
- Height: 0.236" (6.00mm)
- Shape: Rectangle
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.197" (5.00mm)
- Width: 0.197" (5.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.236" (6.00mm)
- Shape: Rectangle
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.394" (10.00mm)
- Width: 0.394" (10.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.591" (15.00mm)
- Shape: Rectangle
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Leader Tech Inc.
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.098" (2.50mm)
- Width: 0.118" (3.00mm)
- Height: 0.098" (2.50mm)
- Shape: Rectangle
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.276" (7.00mm)
- Width: 0.236" (6.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.315" (8.00mm)
- Shape: Hourglass
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Leader Tech Inc.
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.315" (8.00mm)
- Width: 0.354" (9.00mm)
- Height: 0.236" (6.00mm)
- Shape: Rectangle
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Laird Technologies EMI
- Series: SMD Grounding Metallized
- Type: Film Over Foam
- Material: Polyurethane Foam, Tin-Copper Polyester (SN/CU)
- Length: 0.197" (5.00mm)
- Width: 0.236" (6.00mm)
- Operating Temperature: -40°C ~ 70°C
- Height: 0.394" (10.00mm)
- Shape: Hourglass
- Attachment Method: Solder
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
- 10
- 15
- 50
- 100