- Тип
- Производитель
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- Покрытие
- Толщина - общая
- Клейкое вещество
- Толщина покрытия
- Способ крепления
- Серия
Наименование | Описание | Производитель
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Тип
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Материал
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Длина
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Профиль
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Ширина
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Высота
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Рабочая температура
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Покрытие
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Толщина покрытия
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Способ крепления
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Серия
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0097064002 | FINGERSTOCK BECU 27.69X406.4MM | Laird Technologies EMI | Fingerstock | Beryllium Copper | 15.984" (406.00mm) | 1.090" (27.68mm) | 0.260" (6.60mm) | 121°C | Nickel, Tin | 299.99µin (7.62µm) | Clip | Clip-On | |
0097060602 | FINGERSTOCK BECU 9.65X406.4MM | Laird Technologies EMI | Fingerstock | Beryllium Copper | 15.984" (406.00mm) | 0.380" (9.65mm) | 0.200" (5.08mm) | 121°C | Nickel, Tin | 299.99µin (7.62µm) | Clip | Clip-On | |
0097072719 | FOS,NIB | Laird Technologies EMI | Fingerstock | Beryllium Copper | 121°C | Slot | Fiber Optic Shielding | ||||||
67B3G3006010010R0C | SP,CON,AU,TNR 10X3X6MM | Laird Technologies EMI | Fingerstock | Beryllium Copper | 0.236" (6.00mm) | 0.119" (3.00mm) | 0.394" (10.00mm) | Gold | Solder | B3G | |||
0C97055902 | RFI EMI GROUNDING MATERIAL 25FT | Laird Technologies EMI | Fingerstock | Beryllium Copper | 24.000" (609.60mm) | 0.300" (7.62mm) | 0.070" (1.78mm) | 121°C | Unplated | Adhesive | Twist | ||
BMI-C-004 | CONTACT BECU 6.0X4.3MM | Laird Technologies EMI | Fingerstock | Beryllium Copper | 0.235" (5.97mm) | 0.170" (4.32mm) | 0.204" (5.17mm) | Gold | Solder | BMI-C | |||
0077007502 | GASKET BECU 8.26X406.4MM | Laird Technologies EMI | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.325" (8.26mm) | 0.100" (2.54mm) | 121°C | Slot | Dual Slot | |||
0078005617 | VSLMT,STR,SNB,USFT | Laird Technologies EMI | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.320" (8.13mm) | 0.110" (2.79mm) | 121°C | Tin | 299.21µin (7.60µm) | Slot | Ultrasoft Variable Slot Mount | |
0C97044017 | CSTR COIL SNB | Laird Technologies EMI | Fingerstock | Beryllium Copper | 25.000' (7.60m) | 1.630" (41.40mm) | 0.410" (10.41mm) | 121°C | Tin | 299.99µin (7.62µm) | Hardware, Rivet, Solder | Large Enclosure | |
7-19PCI-NI-9.0 | 0.067 X 0.177 NI 9.0--7-19PCI-NI | Leader Tech Inc. | Fingerstock | Beryllium Copper | 9.000" (228.60mm) | 1.800" (45.72mm) | 0.070" (1.78mm) | -55°C ~ 121°C | Nickel | Flash | Adhesive | ||
32-78AH-SN-16 | 0.32 X 0.78 SN 16--32-78AH-SN-16 | Leader Tech Inc. | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.780" (19.81mm) | 0.320" (8.13mm) | -55°C ~ 121°C | Tin | Flash | Adhesive | ||
10-30C-050-DL-BD-16 | 0.10 X 0.30 X 050 DL BD 16--10-3 | Leader Tech Inc. | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.300" (7.62mm) | 0.100" (2.54mm) | -55°C ~ 121°C | Unplated | Adhesive | TechMESH | ||
8-19PCI-NI-9.0 | 0.067 X 0.19 NI 9.0--8-19PCI-NI- | Leader Tech Inc. | Fingerstock | Beryllium Copper | 9.000" (228.60mm) | 0.190" (4.83mm) | 0.080" (2.03mm) | -55°C ~ 121°C | Nickel | Flash | Adhesive | ||
3-S-23T-BD-24 | 0.03 X 0.23 BD 24--3-S-23T-BD-24 | Leader Tech Inc. | Fingerstock | Beryllium Copper | 24.000" (609.60mm) | 0.230" (5.84mm) | 0.030" (0.76mm) | -55°C ~ 121°C | Unplated | Adhesive | |||
14-S-51FSC-SN-16 | 0.14 X 0.51 SN 16.0--FOLDED SERI | Leader Tech Inc. | Fingerstock | Beryllium Copper | 16.000" (406.40mm) | 0.510" (12.95mm) | 0.140" (3.56mm) | -55°C ~ 121°C | Tin | Flash | Adhesive |
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