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- Outline
- Backing, Carrier
- Thermal Resistivity
- Thermal Conductivity
- Series
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- Manufacturer: Laird Technologies - Thermal Materials
- Series: Tmate™ 2900
- Type: Phase Change Pad, Sheet
- Color: Silver, Yellow
- Material: Boron Nitride Filled
- Adhesive: Tacky - Both Sides
- Thickness: 0.0200" (0.508mm)
- Shape: Square
- Outline: 228.60mm x 228.60mm
- Thermal Resistivity: 0.07°C/W
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- Manufacturer: Laird Technologies - Thermal Materials
- Series: Tgard™ 5000
- Type: Die-Cut Pad, Sheet
- Color: Tan
- Material: Polyimide, Silicone Rubber Coated
- Usage: DO-5
- Thickness: 0.0060" (0.152mm)
- Shape: Round
- Outline: 25.40mm x 6.60mm
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- Manufacturer: t-Global Technology
- Series: TG-X
- Type: Conductive Pad, Sheet
- Color: Gray
- Material: Silicone Elastomer
- Adhesive: Tacky - Both Sides
- Thickness: 0.0790" (2.000mm)
- Shape: Square
- Outline: 300.00mm x 300.00mm
- Thermal Conductivity: 12W/m-K
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- Manufacturer: t-Global Technology
- Series: TG832
- Type: Conductive Pad, Sheet
- Color: Pink
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Thickness: 0.0790" (2.000mm)
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thermal Conductivity: 5.0W/m-K
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- Manufacturer: Laird Technologies - Thermal Materials
- Series: Tpli™ 200
- Type: Gap Filler Pad, Sheet
- Color: Gray
- Material: Silicone Elastomer
- Thickness: 0.0900" (2.286mm)
- Shape: Square
- Outline: 203.20mm x 203.20mm
- Thermal Conductivity: 6.0W/m-K
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- Manufacturer: Bergquist
- Series: CPU Pad™
- Type: Pad, Sheet
- Color: Tan
- Usage: CPU
- Thickness: 0.0050" (0.127mm)
- Shape: Square
- Outline: 16.00mm x 16.00mm
- Thermal Conductivity: 0.6W/m-K
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- Manufacturer: Laird Technologies - Thermal Materials
- Series: Tflex™ 300
- Type: Gap Filler Pad, Sheet
- Color: Green
- Material: Silicone Elastomer
- Thickness: 0.0600" (1.524mm)
- Shape: Square
- Outline: 457.20mm x 457.20mm
- Thermal Conductivity: 1.2W/m-K
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- Manufacturer: t-Global Technology
- Series: TG-A4500F
- Type: Gap Filler Pad, Sheet
- Color: Purple
- Material: Silicone
- Usage: Multi
- Adhesive: Tacky - One Side
- Backing, Carrier: Fiberglass
- Thickness: 0.0394" (1.000mm)
- Shape: Square
- Outline: 150.00mm x 150.00mm
- Thermal Conductivity: 4.0W/m-K
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- Manufacturer: t-Global Technology
- Series: TG-A38KF
- Type: Pad, Sheet
- Color: Blue
- Material: Silicone
- Usage: Multi
- Adhesive: Tacky - Both Sides
- Backing, Carrier: Fiberglass
- Thickness: 0.197" (5.00mm)
- Shape: Rectangular
- Outline: 190.00mm x 140.00mm
- Thermal Conductivity: 3.3W/m-K
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- Manufacturer: Shiu Li Technology Co., Ltd.
- Series: N700
- Type: Conductive Pad, Sheet
- Color: Gray
- Material: Non-Silicone
- Adhesive: Tacky - Both Sides
- Thickness: 0.118" (3.00mm)
- Shape: Square
- Outline: 160.00mm x 160.00mm
- Thermal Conductivity: 5.0W/m-K
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- Manufacturer: Aavid, Thermal Division of Boyd Corporation
- Series: Thermalfilm™
- Type: Pad, Sheet
- Color: Amber
- Material: Polyamide
- Thickness: 0.0020" (0.051mm)
- Shape: Rectangular
- Outline: 20.62mm x 14.27mm
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- Manufacturer: t-Global Technology
- Series: TG-A1250
- Type: Gap Filler Pad, Sheet
- Color: Green
- Material: Silicone
- Usage: Multi
- Thickness: 0.0394" (1.000mm)
- Shape: Square
- Outline: 30.00mm x 30.00mm
- Thermal Conductivity: 12.5W/m-K
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- Manufacturer: t-Global Technology
- Series: TG-A20KX
- Type: Pad, Sheet
- Color: Gray
- Material: Silicone
- Usage: Multi
- Adhesive: Tacky - One Side
- Thickness: 0.157" (4.00mm)
- Shape: Rectangular
- Outline: 285.00mm x 190.00mm
- Thermal Conductivity: 2.0W/m-K
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- Manufacturer: t-Global Technology
- Series: PC99AL
- Type: Die-Cut Pad, Sheet
- Color: Gray
- Material: Phase Change Compound
- Usage: Relay Pad
- Backing, Carrier: Aluminum
- Thickness: 0.0039" (0.100mm)
- Shape: Rectangular
- Outline: 70.10mm x 27.00mm
- Thermal Conductivity: 1.5W/m-K
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- Manufacturer: t-Global Technology
- Series: L37-5S
- Type: Gel Pad, Sheet
- Color: Gray
- Material: Silicone Elastomer
- Thickness: 0.0394" (1.000mm)
- Shape: Square
- Outline: 100.00mm x 100.00mm
- Thermal Conductivity: 1.6W/m-K
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