- Memory Size
- Memory Format
- Clock Frequency
- Memory Type
-
- Operating Temperature
- Supplier Device Package
- Package / Case
- Access Time
- Memory Interface
- Write Cycle Time - Word, Page
- Series
-
- Manufacturer: Micron Technology Inc.
- Series: e•MMC™
- Mounting Type: Surface Mount
- Operating Temperature: -25°C ~ 85°C (TA)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: MMC
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- Manufacturer: Silicon Motion, Inc.
- Series: Ferri-eMMC®
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 100-LBGA
- Supplier Device Package: 100-BGA (14x18)
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND (TLC)
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: eMMC
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- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: Parallel
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- Manufacturer: Micron Technology Inc.
- Operating Temperature: -40°C ~ 85°C (TA)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Clock Frequency: 166MHz
- Memory Format: FLASH
- Memory Interface: Parallel
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- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 48-TFSOP (0.724", 18.40mm Width)
- Supplier Device Package: 48-TSOP I
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: Parallel
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-
- Manufacturer: Micron Technology Inc.
- Series: e•MMC™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 169-TFBGA
- Supplier Device Package: 169-TFBGA (14x18)
- Voltage - Supply: 1.7V ~ 1.9V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: MMC
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- Manufacturer: Silicon Motion, Inc.
- Series: Ferri-UFS ™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C
- Package / Case: 153-TFBGA
- Supplier Device Package: 153-BGA (11.5x13)
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND (TLC)
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: UFS2.1
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- Manufacturer: Micron Technology Inc.
- Series: e•MMC™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 153-TFBGA
- Supplier Device Package: 153-TFBGA (11.5x13)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: MMC
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- Manufacturer: Kioxia America, Inc.
- Series: e•MMC™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 153-WFBGA
- Supplier Device Package: 153-WFBGA (11.5x13)
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: eMMC
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- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 152-VBGA
- Supplier Device Package: 152-VBGA (14x18)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Clock Frequency: 83MHz
- Memory Format: FLASH
- Memory Interface: Parallel
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- Manufacturer: Flexxon Pte Ltd
- Series: XTRA III
- Mounting Type: Surface Mount
- Operating Temperature: -25°C ~ 85°C
- Package / Case: 100-LBGA
- Supplier Device Package: 100-FBGA (14x18)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND (MLC)
- Memory Type: Non-Volatile
- Clock Frequency: 200MHz
- Memory Format: FLASH
- Memory Interface: eMMC
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-
- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: Parallel
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- Manufacturer: ATP Electronics, Inc.
- Series: Automotive
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 153-FBGA
- Supplier Device Package: 153-BGA (11.5x13)
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND (MLC)
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: eMMC
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-
- Manufacturer: Micron Technology Inc.
- Series: e•MMC™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 169-TFBGA
- Supplier Device Package: 169-TFBGA (14x18)
- Voltage - Supply: 1.65V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Memory Format: FLASH
- Memory Interface: MMC
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-
- Manufacturer: Micron Technology Inc.
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 132-VBGA
- Supplier Device Package: 132-VBGA (12x18)
- Voltage - Supply: 2.7V ~ 3.6V
- Memory Size: 128Gb (16G x 8)
- Technology: FLASH - NAND
- Memory Type: Non-Volatile
- Clock Frequency: 267MHz
- Memory Format: FLASH
- Memory Interface: Parallel
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- Offers in stock:
- 10
- 15
- 50
- 100