• Manufacturer: Renesas Electronics America Inc
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 84-BPGA
• Supplier Device Package: 84-PGA (27.94x27.94)
• Voltage - Supply: 4.5V ~ 5.5V
• Memory Size: 128Kb (8K x 16)
• Technology: SARAM
• Memory Type: Volatile
• Access Time: 25ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 25ns
• Memory Interface: Parallel

• Manufacturer: Everspin Technologies Inc.
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Voltage - Supply: 3V ~ 3.6V
• Memory Size: 1Mb (128K x 8)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Access Time: 35ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 35ns
• Memory Interface: Parallel

• Manufacturer: Advanced Micro Devices
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C (TA)
• Package / Case: 28-CLCC
• Supplier Device Package: 28-CLCC
• Voltage - Supply: 4.5V ~ 5.5V
• Memory Size: 1Kb (256 x 4)
• Technology: RAM
• Memory Type: Volatile
• Access Time: 55ns
• Memory Format: RAM
• Memory Interface: Parallel

• Manufacturer: Renesas Electronics America Inc
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 80-LQFP
• Supplier Device Package: 80-TQFP (14x14)
• Voltage - Supply: 4.5V ~ 5.5V
• Memory Size: 64Kb (4K x 16)
• Technology: SARAM
• Memory Type: Volatile
• Access Time: 20ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 20ns
• Memory Interface: Parallel

• Manufacturer: Advanced Micro Devices
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 16-DIP
• Supplier Device Package: 16-PDIP
• Voltage - Supply: 4.75V ~ 5.25V
• Memory Size: 64b (16 x 4)
• Technology: RAM
• Memory Type: Volatile
• Access Time: 15ns
• Memory Format: RAM
• Memory Interface: Parallel

• Manufacturer: Everspin Technologies Inc.
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 44-TSOP (0.400", 10.16mm Width)
• Supplier Device Package: 44-TSOP2
• Voltage - Supply: 3V ~ 3.6V
• Memory Size: 4Mb (512K x 8)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Access Time: 35ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 35ns
• Memory Interface: Parallel

• Manufacturer: Advanced Micro Devices
• Mounting Type: Through Hole
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 22-DIP
• Supplier Device Package: 22-PDIP
• Voltage - Supply: 4.75V ~ 5.25V
• Memory Size: 1Kb (256 x 4)
• Technology: RAM
• Memory Type: Volatile
• Access Time: 45ns
• Memory Format: RAM
• Memory Interface: Parallel

• Manufacturer: Everspin Technologies Inc.
• Series: Automotive, AEC-Q100
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 48-LFBGA
• Supplier Device Package: 48-FBGA (10x10)
• Voltage - Supply: 3V ~ 3.6V
• Memory Size: 32Mb (2M x 16)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Access Time: 35ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 35ns
• Memory Interface: Parallel

• Manufacturer: Micron Technology Inc.
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 95°C (TC)
• Package / Case: 170-TFBGA
• Supplier Device Package: 170-FBGA (12x14)
• Voltage - Supply: 1.31V ~ 1.65V
• Memory Size: 4Gb (128M x 32)
• Technology: SGRAM - GDDR5
• Memory Type: Volatile
• Clock Frequency: 1.25GHz
• Memory Format: RAM
• Memory Interface: Parallel

• Manufacturer: Renesas Electronics America Inc
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 2.7V ~ 3.6V
• Memory Size: 16Mb (4M x 4)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Clock Frequency: 54MHz
• Memory Format: RAM
• Memory Interface: SPI

• Manufacturer: Renesas Electronics America Inc
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 48-LFBGA
• Supplier Device Package: 48-FBGA (10x10)
• Voltage - Supply: 2.7V ~ 3.6V
• Memory Size: 4Mb (256K x 16)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Access Time: 45ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 45ns
• Memory Interface: Parallel

• Manufacturer: Renesas Electronics America Inc
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (0.209", 5.30mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 1.71V ~ 2V
• Memory Size: 4Mb (1M x 4)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Clock Frequency: 108MHz
• Memory Format: RAM
• Memory Interface: SPI

• Manufacturer: Everspin Technologies Inc.
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: 32-SOIC (0.295", 7.50mm Width)
• Supplier Device Package: 32-SOIC
• Voltage - Supply: 3V ~ 3.6V
• Memory Size: 256Kb (32K x 8)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Access Time: 35ns
• Memory Format: RAM
• Write Cycle Time - Word, Page: 35ns
• Memory Interface: Parallel

• Manufacturer: Micron Technology Inc.
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 95°C (TC)
• Package / Case: 170-TFBGA
• Supplier Device Package: 170-FBGA (12x14)
• Memory Size: 4Gb (128M x 32)
• Technology: SGRAM - GDDR5
• Memory Type: Volatile
• Clock Frequency: 1.5GHz
• Memory Format: RAM
• Memory Interface: Parallel

• Manufacturer: Renesas Electronics America Inc
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 8-WDFN Exposed Pad
• Supplier Device Package: 8-DFN (5x6)
• Voltage - Supply: 2.7V ~ 3.6V
• Memory Size: 16Mb (4M x 4)
• Technology: MRAM (Magnetoresistive RAM)
• Memory Type: Non-Volatile
• Clock Frequency: 108MHz
• Memory Format: RAM