• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-TDFN (2x3)
• Voltage - Supply: 1.8V ~ 5.5V
• Memory Size: 64Kb (8K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-TDFN
• Supplier Device Package: 8-LAP (8x5)
• Voltage - Supply: 1.8V ~ 5.5V
• Memory Size: 512Kb (64K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 10ms
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 2.5V ~ 5.5V
• Memory Size: 4Kb (512 x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 2.5V ~ 5.5V
• Memory Size: 2Kb (256 x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: AKM Semiconductor Inc.
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP, 8-MSOP (0.110", 2.80mm Width)
• Supplier Device Package: 8-TMSOP
• Voltage - Supply: 1.6V ~ 5.5V
• Memory Size: 16Kb (2K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Memory Interface: SPI

• Manufacturer: Adesto Technologies
• Series: Mavriq™
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 1.65V ~ 3.6V
• Memory Size: 128kb (64B Page Size)
• Technology: CBRAM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: CBRAM®
• Write Cycle Time - Word, Page: 100µs, 5ms
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 125°C (TA)
• Package / Case: 8-VDFN Exposed Pad
• Supplier Device Package: 8-DFN-S (6x5)
• Voltage - Supply: 2.5V ~ 5.5V
• Memory Size: 256Kb (32K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 70°C (TA)
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Supply: 2.5V ~ 5.5V
• Memory Size: 2Kb (256 x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: Fujitsu Electronics America, Inc.
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-SON
• Voltage - Supply: 1.8V ~ 3.6V
• Memory Size: 64Kb (8K x 8)
• Technology: FRAM (Ferroelectric RAM)
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: FRAM
• Memory Interface: SPI

• Manufacturer: Kaga FEI America, Inc.
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 85°C (TA)
• Package / Case: 8-WFDFN Exposed Pad
• Supplier Device Package: 8-SON (2x3)
• Voltage - Supply: 1.8V ~ 3.6V
• Memory Size: 64Kb (8K x 8)
• Technology: FRAM (Ferroelectric RAM)
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: FRAM
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Supply: 1.8V ~ 5.5V
• Memory Size: 8Kb (1K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 1.7V ~ 3V
• Memory Size: 512Kb (64K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: onsemi
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 125°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 1.8V ~ 5.5V
• Memory Size: 32Kb (4K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI

• Manufacturer: Asahi Kasei Microdevices/AKM
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOP
• Voltage - Supply: 1.8V ~ 5.5V
• Memory Size: 128Kb (16K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Memory Interface: SPI

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 85°C (TA)
• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Supplier Device Package: 8-SOIC
• Voltage - Supply: 2.5V ~ 5.5V
• Memory Size: 32Kb (4K x 8)
• Technology: EEPROM
• Memory Type: Non-Volatile
• Clock Frequency: 10MHz
• Memory Format: EEPROM
• Write Cycle Time - Word, Page: 5ms
• Memory Interface: SPI