- Embedded - Microcontrollers 102064
- Embedded - Microprocessors 7562
- Embedded - FPGAs (Field Programmable Gate Array) 29783
- Embedded - CPLDs (Complex Programmable Logic Devices) 5616
- Embedded - System On Chip (SoC) 3809
- Embedded - DSP (Digital Signal Processors) 4396
- Embedded - Microcontroller, Microprocessor, FPGA Modules 1413
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- Voltage - Supply
- Operating Temperature
- Supplier Device Package
- Core Processor
- Speed
- Programmable Type
- Module/Board Type
- Number of I/O
- Number of Cores/Bus Width
- Voltage - Supply (Vcc/Vdd)
- Core Size
- Peripherals
- Primary Attributes
- Architecture
- Flash Size
- RAM Size
- Connectivity
- Number of LABs/CLBs
- Number of Macrocells
- Delay Time tpd(1) Max
- Program Memory Size
- Program Memory Type
- Controller Series
- Ethernet
- USB
- EEPROM Size
- Voltage Supply - Internal
- Clock Rate
- Co-Processor
- Non-Volatile Memory
- Co-Processors/DSP
- On-Chip RAM
- RAM Controllers
- Graphics Acceleration
- Voltage - I/O
- Voltage - Core
- Data Converters
- Oscillator Type
- Number of Logic Elements/Blocks
- Number of Gates
- Display & Interface Controllers
- SATA
- Security Features
- Number of Logic Elements/Cells
- Total RAM Bits
- Series
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- Manufacturer: Microchip Technology
- Series: SX-A
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C (TC)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
- Voltage - Supply: 2.25V ~ 5.25V
- Number of I/O: 203
- Number of Gates: 48000
- Number of LABs/CLBs: 2880
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- Manufacturer: Renesas Electronics America Inc
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- Manufacturer: Texas Instruments
- Series: MSP430™ FRAM
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (12x12)
- Speed: 16MHz
- Core Size: 16-Bit
- Core Processor: MSP430 CPUXV2
- Program Memory Type: FRAM
- RAM Size: 12K x 8
- Number of I/O: 57
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT
- Connectivity: IrDA, SCI, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 10x12b SAR
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- Manufacturer: Microchip Technology
- Series: SAM4E
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LQFP (20x20)
- Speed: 120MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M4
- Program Memory Type: FLASH
- RAM Size: 128K x 8
- Number of I/O: 117
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, IrDA, SD, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
- Program Memory Size: 512KB (512K x 8)
- Data Converters: A/D 16x12b; D/A 2x12b
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- Manufacturer: Renesas Electronics America Inc
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- Manufacturer: Zilog
- Series: Z8 Encore! XP®
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 80-LQFP
- Supplier Device Package: 80-LQFP (10x10)
- Speed: 24MHz
- Core Size: 8-Bit
- Core Processor: eZ8
- Program Memory Type: FLASH
- RAM Size: 3.75K x 8
- Number of I/O: 67
- Peripherals: DMA, LCD, LVD, POR, PWM, WDT
- Connectivity: DALI, DMX, I²C, LINbus, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 12x12b; D/A 1x12b
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- Manufacturer: Lattice Semiconductor Corporation
- Series: MachXO3D
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LFBGA
- Supplier Device Package: 256-CABGA (14x14)
- Voltage - Supply: 2.375V ~ 3.465V
- Number of I/O: 206
- Number of LABs/CLBs: 1175
- Number of Logic Elements/Cells: 9400
- Total RAM Bits: 442368
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- Manufacturer: Microchip Technology
- Series: PIC® 16F
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 44-VQFN Exposed Pad
- Supplier Device Package: 44-QFN (8x8)
- Speed: 20MHz
- Core Size: 8-Bit
- Core Processor: PIC
- Program Memory Type: FLASH
- RAM Size: 192 x 8
- Number of I/O: 33
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Connectivity: I²C, SPI, UART/USART
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
- EEPROM Size: 128 x 8
- Program Memory Size: 7KB (4K x 14)
- Data Converters: A/D 8x10b
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 90K Logic Modules
- Flash Size: 512KB
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- Manufacturer: Cypress Semiconductor Corp
- Series: F²MC-16LX MB90920
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 120-LQFP
- Supplier Device Package: 120-LQFP (16x16)
- Speed: 32MHz
- Core Size: 16-Bit
- Core Processor: F²MC-16LX
- Program Memory Type: Mask ROM
- RAM Size: 10K x 8
- Number of I/O: 93
- Peripherals: LCD, LVD, POR, PWM, WDT
- Connectivity: CANbus, LINbus, UART/USART
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 4V ~ 5.5V
- Program Memory Size: 256KB (256K x 8)
- Data Converters: A/D 8x8/10b
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- Manufacturer: Cypress Semiconductor Corp
- Series: F²MC-8L MB89630R
- Mounting Type: Through Hole
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-DIP (0.750", 19.05mm)
- Supplier Device Package: 64-SH-DIP
- Speed: 10MHz
- Core Size: 8-Bit
- Core Processor: F²MC-8L
- Program Memory Type: Mask ROM
- RAM Size: 1K x 8
- Number of I/O: 53
- Peripherals: POR, PWM, WDT
- Connectivity: EBI/EMI, Serial I/O, UART/USART
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
- Program Memory Size: 32KB (32K x 8)
- Data Converters: A/D 8x10b
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- Manufacturer: Trenz Electronic GmbH
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- Manufacturer: Rochester Electronics, LLC
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- Manufacturer: Analog Devices Inc./Maxim Integrated
- Series: DeepCover®
- Mounting Type: Surface Mount
- Package / Case: 64-WFBGA, WLBGA
- Supplier Device Package: 64-WLP (4.34x4.34)
- Speed: 60MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M3
- Program Memory Type: FLASH
- RAM Size: 96K x 8
- Number of I/O: 27
- Peripherals: DMA, PWM, WDT
- Connectivity: I²C, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 3.3V
- Program Memory Size: 512KB (512K x 8)
- Data Converters: A/D 1x10b
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- Manufacturer: Silicon Labs
- Series: Gecko
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-QFN (9x9)
- Speed: 32MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M3
- Program Memory Type: FLASH
- RAM Size: 8K x 8
- Number of I/O: 56
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Connectivity: I²C, IrDA, SmartCard, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.98V ~ 3.8V
- Program Memory Size: 32KB (32K x 8)
- Data Converters: A/D 8x12b; D/A 2x12b
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