- Embedded - Microcontrollers 102064
- Embedded - Microprocessors 7562
- Embedded - FPGAs (Field Programmable Gate Array) 29783
- Embedded - CPLDs (Complex Programmable Logic Devices) 5616
- Embedded - System On Chip (SoC) 3809
- Embedded - DSP (Digital Signal Processors) 4396
- Embedded - Microcontroller, Microprocessor, FPGA Modules 1413
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- Voltage - Supply
- Operating Temperature
- Supplier Device Package
- Core Processor
- Speed
- Programmable Type
- Module/Board Type
- Number of I/O
- Number of Cores/Bus Width
- Voltage - Supply (Vcc/Vdd)
- Core Size
- Peripherals
- Primary Attributes
- Architecture
- Flash Size
- RAM Size
- Connectivity
- Number of LABs/CLBs
- Number of Macrocells
- Delay Time tpd(1) Max
- Program Memory Size
- Program Memory Type
- Controller Series
- Ethernet
- USB
- EEPROM Size
- Voltage Supply - Internal
- Clock Rate
- Co-Processor
- Non-Volatile Memory
- Co-Processors/DSP
- On-Chip RAM
- RAM Controllers
- Graphics Acceleration
- Voltage - I/O
- Voltage - Core
- Data Converters
- Oscillator Type
- Number of Logic Elements/Blocks
- Number of Gates
- Display & Interface Controllers
- SATA
- Security Features
- Number of Logic Elements/Cells
- Total RAM Bits
- Series
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- Manufacturer: Lattice Semiconductor Corporation
- Series: ispXPGA®
- Mounting Type: Surface Mount
- Package / Case: 256-BGA
- Supplier Device Package: 256-FPBGA (17x17)
- Voltage - Supply: 2.3V ~ 3.6V
- Number of Gates: 210000
- Number of LABs/CLBs: 676
- Total RAM Bits: 113664
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- Manufacturer: NXP USA Inc.
- Series: LPC900
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-LQFP
- Supplier Device Package: 64-LQFP (14x14)
- Speed: 18MHz
- Core Size: 8-Bit
- Core Processor: 8051
- Program Memory Type: FLASH
- RAM Size: 256 x 8
- Number of I/O: 23
- Peripherals: Brown-out Detect/Reset, LCD, LED, POR, PWM, WDT
- Connectivity: I²C, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
- EEPROM Size: 512 x 8
- Program Memory Size: 8KB (8K x 8)
- Data Converters: A/D 8x10b
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- Manufacturer: Microchip Technology
- Series: PIC® 32MX
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-VQFN (9x9)
- Speed: 80MHz
- Core Size: 32-Bit Single-Core
- Core Processor: MIPS32® M4K™
- Program Memory Type: FLASH
- RAM Size: 64K x 8
- Number of I/O: 53
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Connectivity: CANbus, I²C, SPI, UART/USART, USB OTG
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
- Program Memory Size: 256KB (256K x 8)
- Data Converters: A/D 16x10b
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- Manufacturer: Lattice Semiconductor Corporation
- Series: SCM
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1020-BBGA, FCBGA
- Supplier Device Package: 1020-OFCBGA (33x33)
- Voltage - Supply: 0.95V ~ 1.26V
- Number of I/O: 562
- Number of LABs/CLBs: 10000
- Number of Logic Elements/Cells: 40000
- Total RAM Bits: 4075520
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- Manufacturer: Microchip Technology
- Series: Automotive, AEC-Q100, ProASIC3
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 100-TQFP
- Supplier Device Package: 100-VQFP (14x14)
- Voltage - Supply: 1.425V ~ 1.575V
- Number of I/O: 68
- Number of Gates: 250000
- Total RAM Bits: 36864
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- Manufacturer: Microchip Technology
- Series: Automotive, AEC-Q100, SAM D21G, Functional Safety (FuSa)
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 48-TQFP
- Supplier Device Package: 48-TQFP (7x7)
- Speed: 48MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M0+
- Program Memory Type: FLASH
- RAM Size: 8K x 8
- Number of I/O: 38
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Connectivity: I²C, LINbus, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 14x12b; D/A 1x10b
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- Manufacturer: Rochester Electronics, LLC
- Series: FM3 MB9B410R
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 120-LQFP
- Supplier Device Package: 120-LQFP (16x16)
- Speed: 144MHz
- Core Size: 32-Bit
- Core Processor: ARM® Cortex®-M3
- Program Memory Type: FLASH
- RAM Size: 64K x 8
- Number of I/O: 103
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- Program Memory Size: 512KB (512K x 8)
- Data Converters: A/D 16x12b
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- Manufacturer: Renesas Electronics America Inc
- Series: RL78/G13
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 48-WFQFN Exposed Pad
- Supplier Device Package: 48-HWQFN (7x7)
- Speed: 32MHz
- Core Size: 16-Bit
- Core Processor: RL78
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 34
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: CSI, I²C, LINbus, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V
- EEPROM Size: 4K x 8
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 10x8/10b
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- Manufacturer: Rochester Electronics, LLC
- Series: HCS12
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 112-LQFP
- Supplier Device Package: 112-LQFP (20x20)
- Speed: 25MHz
- Core Size: 16-Bit
- Core Processor: HCS12
- Program Memory Type: FLASH
- RAM Size: 12K x 8
- Number of I/O: 91
- Peripherals: PWM, WDT
- Connectivity: CANbus, I²C, SCI, SPI
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
- EEPROM Size: 4K x 8
- Program Memory Size: 256KB (256K x 8)
- Data Converters: A/D 16x10b
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- Manufacturer: Analog Devices Inc.
- Series: Blackfin®
- Type: Fixed Point
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 289-LFBGA, CSPBGA
- Supplier Device Package: 289-CSPBGA (12x12)
- Interface: DMA, I²C, PPI, SPI, SPORT, UART, USB
- Clock Rate: 400MHz
- Non-Volatile Memory: ROM (32kB)
- On-Chip RAM: 132kB
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Voltage - Core: 1.30V
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- Manufacturer: Atmel
- Series: Automotive, AEC-Q100, AVR® ATtiny
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 32-TQFP
- Supplier Device Package: 32-TQFP (7x7)
- Speed: 16MHz
- Core Size: 8-Bit
- Core Processor: AVR
- Program Memory Type: FLASH
- RAM Size: 512 x 8
- Number of I/O: 28
- Peripherals: Brown-out Detect/Reset, POR, WDT
- Connectivity: I²C, SPI
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- EEPROM Size: 64 x 8
- Program Memory Size: 8KB (4K x 16)
- Data Converters: A/D 8x10b
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- Manufacturer: Infineon Technologies
- Series: AURIX™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: 48-VFQFN Exposed Pad
- Supplier Device Package: PG-VQFN-48-31
- Speed: 40MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M0+
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 10
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Connectivity: LINbus, SSC, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 3V ~ 28V
- EEPROM Size: 4K x 8
- Program Memory Size: 48KB (48K x 8)
- Data Converters: A/D 9x8b, 11x10b
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- Manufacturer: Zilog
- Series: Z8® GP™
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 20-SSOP (0.209", 5.30mm Width)
- Speed: 8MHz
- Core Size: 8-Bit
- Core Processor: Z8
- Program Memory Type: OTP
- RAM Size: 237 x 8
- Number of I/O: 16
- Peripherals: HLVD, POR, WDT
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
- Program Memory Size: 32KB (32K x 8)
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- Manufacturer: Cypress Semiconductor Corp
- Series: PSOC® 5 CY8C55
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 100-LQFP
- Supplier Device Package: 100-TQFP (14x14)
- Speed: 67MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M3
- Program Memory Type: FLASH
- RAM Size: 16K x 8
- Number of I/O: 60
- Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
- Connectivity: I²C, LINbus, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
- EEPROM Size: 2K x 8
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 1x20b, 1x12b; D/A 4x8b
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- Manufacturer: Microchip Technology
- Series: SAM L21J, Functional Safety (FuSa)
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-QFN (9x9)
- Speed: 48MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M0+
- Program Memory Type: FLASH
- RAM Size: 32K x 8
- Number of I/O: 51
- Peripherals: DMA, POR, PWM, WDT
- Connectivity: I²C, LINbus, SCI, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.63V
- Program Memory Size: 256KB (256K x 8)
- Data Converters: A/D 20x12b; D/A 2x12b
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- Offers in stock:
- 10
- 15
- 50
- 100