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- Architecture
- Flash Size
- RAM Size
- Connectivity
- Series
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- Manufacturer: Intel
- Series: Arria 10 SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA, FC (29x29)
- Speed: 1.5GHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 320K Logic Elements
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BFBGA
- Supplier Device Package: 484-FBGA (19x19)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 150K Logic Modules
- Flash Size: 512KB
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- Manufacturer: Broadcom Limited
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ RFSoC
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
- Speed: 533MHz, 1.333GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
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- Manufacturer: Intel
- Series: Arria V SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA, FC (35x35)
- Speed: 800MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 350K Logic Elements
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 10K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 536-LFBGA, CSPBGA
- Supplier Device Package: 536-CSPBGA (16x16)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 150K Logic Modules
- Flash Size: 512KB
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- Manufacturer: Broadcom Limited
- Speed: 1.25GHz
- Core Processor: ARM® Cortex®-A9, ARM® Cortex®-R5
- Architecture: MPU
- Peripherals: SERDES
- Connectivity: ACL, MAC, QSGMII
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- Manufacturer: Microchip Technology
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- Manufacturer: Intel
- Series: Arria 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 672-BBGA, FCBGA
- Supplier Device Package: 672-FBGA, FC (27x27)
- Speed: 1.5GHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 220K Logic Elements
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC CG
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 530-WFBGA, FCBGA
- Supplier Device Package: 530-FCBGA (16x9.5)
- Speed: 500MHz, 1.2GHz
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MPU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 325-TFBGA, FCBGA
- Supplier Device Package: 325-FCBGA (11x11)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microchip Technology
- Series: SmartFusion®
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 100MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
- Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size: 256KB
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 5K Logic Modules
- Flash Size: 128KB
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- Offers in stock:
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