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- Core Processor
- Speed
- Number of I/O
- Voltage - Supply (Vcc/Vdd)
- Core Size
- Peripherals
- RAM Size
- Connectivity
- Program Memory Size
- Program Memory Type
- Controller Series
- EEPROM Size
- Data Converters
- Oscillator Type
- Series
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- Manufacturer: Microchip Technology
- Series: PIC® XLP™ 18K
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 44-VQFN Exposed Pad
- Supplier Device Package: 44-QFN (8x8)
- Speed: 48MHz
- Core Size: 8-Bit
- Core Processor: PIC
- Program Memory Type: FLASH
- RAM Size: 1.5K x 8
- Number of I/O: 35
- Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
- Connectivity: I²C, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
- EEPROM Size: 256 x 8
- Program Memory Size: 32KB (16K x 16)
- Data Converters: A/D 30x10b
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- Manufacturer: Cypress Semiconductor Corp
- Mounting Type: Surface Mount
- Package / Case: 120-LQFP
- Supplier Device Package: 120-LQFP (16x16)
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- Manufacturer: NXP USA Inc.
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 90°C (TA)
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
- Applications: Authentication
- Voltage - Supply: 1.62V ~ 5.5V
- Interface: I²C
- Core Processor: MX51
- Program Memory Type: EEPROM (76.4kB)
- Controller Series: A700x
- RAM Size: 3.2kB
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- Manufacturer: STMicroelectronics
- Series: STM32F7
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 201-UFBGA
- Supplier Device Package: 176+25UFBGA (10x10)
- Speed: 216MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M7
- Program Memory Type: FLASH
- RAM Size: 320K x 8
- Number of I/O: 140
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB OTG
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
- Program Memory Size: 512KB (512K x 8)
- Data Converters: A/D 24x12b; D/A 2x12b
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- Manufacturer: Microchip Technology
- Series: PIC® 16C
- Mounting Type: Through Hole
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 18-DIP (0.300", 7.62mm)
- Supplier Device Package: 18-PDIP
- Speed: 20MHz
- Core Size: 8-Bit
- Core Processor: PIC
- Program Memory Type: OTP
- RAM Size: 25 x 8
- Number of I/O: 12
- Peripherals: POR, WDT
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Program Memory Size: 768B (512 x 12)
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- Manufacturer: Renesas Electronics America Inc
- Series: RH850/F1L
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LFQFP (20x20)
- Speed: 96MHz
- Core Size: 32-Bit Single-Core
- Core Processor: RH850G3K
- Program Memory Type: FLASH
- RAM Size: 160K x 8
- Number of I/O: 120
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- EEPROM Size: 64K x 8
- Program Memory Size: 1.5MB (1.5M x 8)
- Data Converters: A/D 24x12b, 24x10b
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- Manufacturer: Renesas Electronics America Inc
- Series: 78K0R/Kx3-L
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-TQFP
- Speed: 20MHz
- Core Size: 16-Bit
- Core Processor: 78K/0R
- Program Memory Type: FLASH
- RAM Size: 2K x 8
- Number of I/O: 50
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: 3-Wire SIO, I²C, LINbus, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
- Program Memory Size: 48KB (48K x 8)
- Data Converters: A/D 12x10b
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- Manufacturer: Microchip Technology
- Series: AVR® XMEGA® D3
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-QFN (9x9)
- Speed: 32MHz
- Core Size: 8/16-Bit
- Core Processor: AVR
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 50
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Connectivity: I²C, IrDA, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
- EEPROM Size: 1K x 8
- Program Memory Size: 32KB (16K x 16)
- Data Converters: A/D 16x12b
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- Manufacturer: Cypress Semiconductor Corp
- Series: F²MC-16LX MB90595G
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 100-BQFP
- Supplier Device Package: 100-QFP (14x20)
- Speed: 16MHz
- Core Size: 16-Bit
- Core Processor: F²MC-16LX
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 78
- Peripherals: POR, PWM, WDT
- Connectivity: CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Program Memory Size: 128KB (128K x 8)
- Data Converters: A/D 8x8/10b
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- Manufacturer: Silicon Labs
- Series: C8051F83x
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 16-SOIC (0.154", 3.90mm Width)
- Supplier Device Package: 16-SOIC
- Speed: 25MHz
- Core Size: 8-Bit
- Core Processor: 8051
- Program Memory Type: FLASH
- RAM Size: 256 x 8
- Number of I/O: 13
- Peripherals: POR, PWM, WDT
- Connectivity: SMBus (2-Wire/I²C), SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Program Memory Size: 4KB (4K x 8)
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- Manufacturer: Renesas Electronics America Inc
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- Manufacturer: Microchip Technology
- Series: SAM D21E, Functional Safety (FuSa)
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-VQFN (5x5)
- Speed: 48MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M0+
- Program Memory Type: FLASH
- RAM Size: 8K x 8
- Number of I/O: 26
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Connectivity: I²C, LINbus, SPI, UART/USART, USB
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.62V ~ 3.6V
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 10x12b; D/A 1x10b
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- Manufacturer: Cypress Semiconductor Corp
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- Manufacturer: Texas Instruments
- Series: MSP430G2xx
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 20-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 20-TSSOP
- Speed: 16MHz
- Core Size: 16-Bit
- Core Processor: MSP430 CPU16
- Program Memory Type: FLASH
- RAM Size: 512 x 8
- Number of I/O: 16
- Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
- Connectivity: I²C, IrDA, LINbus, SCI, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Program Memory Size: 8KB (8K x 8)
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- Manufacturer: Microchip Technology
- Series: dsPIC™ 33EP, Functional Safety (FuSa)
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-TQFP
- Supplier Device Package: 64-TQFP (10x10)
- Speed: 70 MIPs
- Core Size: 16-Bit
- Core Processor: dsPIC
- Program Memory Type: FLASH
- RAM Size: 2K x 8
- Number of I/O: 53
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
- Program Memory Size: 16KB (16K x 8)
- Data Converters: A/D 22x12b; D/A 2x12b
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- Offers in stock:
- 10
- 15
- 50
- 100