• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10µA @ 5V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 6.2V

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 5µA @ 2V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 5.1V
• Impedance (Max) (Zzt): 17 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 62V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 82V
• Impedance (Max) (Zzt): 330 Ohms

• Manufacturer: SMC Diode Solutions
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 150°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 3µA @ 5V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 6.8V
• Impedance (Max) (Zzt): 5 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 4µA @ 2V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 4.3V

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 29.8V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 39V

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 27V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 36V
• Impedance (Max) (Zzt): 70 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 66.12V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 87V
• Impedance (Max) (Zzt): 1000 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 18V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 20V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 50nA @ 8.44V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 11V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 11.7V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 13V
• Impedance (Max) (Zzt): 90 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 36V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 47V
• Impedance (Max) (Zzt): 105 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 3µA @ 6.5V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 8.7V
• Impedance (Max) (Zzt): 8 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 29.7V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 33V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 6.6V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 8.7V