• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 18V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 24V
• Impedance (Max) (Zzt): 33 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 38.76V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 51V
• Impedance (Max) (Zzt): 300 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100µA @ 1V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 2.4V
• Impedance (Max) (Zzt): 30 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 17V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 22V
• Impedance (Max) (Zzt): 29 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 11V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 15V
• Impedance (Max) (Zzt): 16 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 1V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 2.7V

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 27.38V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 36V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 23V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 30V
• Impedance (Max) (Zzt): 49 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 2µA @ 4V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 6.8V
• Impedance (Max) (Zzt): 5 Ohms

• Manufacturer: SMC Diode Solutions
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 150°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
• Current - Reverse Leakage @ Vr: 1µA @ 9.1V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 12V
• Impedance (Max) (Zzt): 30 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 5µA @ 2V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 4.7V
• Impedance (Max) (Zzt): 19 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 46V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 60V
• Impedance (Max) (Zzt): 170 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 50nA @ 12.92V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 17V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 16.72V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 22V
• Impedance (Max) (Zzt): 150 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 3µA @ 1V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 3.6V
• Impedance (Max) (Zzt): 24 Ohms