-
- Configuration
- Operating Temperature
- Current - Reverse Leakage @ Vr
- Voltage - Forward (Vf) (Max) @ If
- Series
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 100nA @ 38.8V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 51V
- Impedance (Max) (Zzt): 95 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 100nA @ 20.6V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 27V
- Impedance (Max) (Zzt): 35 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 3µA @ 6V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 8.2V
- Impedance (Max) (Zzt): 4.5 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 100nA @ 51.7V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 68V
- Impedance (Max) (Zzt): 150 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
- Current - Reverse Leakage @ Vr: 5µA @ 7.6V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 10V
- Impedance (Max) (Zzt): 7 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 1µA @ 9.1V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 12V
- Impedance (Max) (Zzt): 9 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
- Current - Reverse Leakage @ Vr: 500nA @ 9.9V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 13V
- Impedance (Max) (Zzt): 10 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 3µA @ 5V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 7.5V
- Impedance (Max) (Zzt): 4 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 100nA @ 47.1V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 62V
- Impedance (Max) (Zzt): 125 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
- Current - Reverse Leakage @ Vr: 500nA @ 13.7V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 18V
- Impedance (Max) (Zzt): 20 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 100nA @ 62.2V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 82V
- Impedance (Max) (Zzt): 200 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
- Current - Reverse Leakage @ Vr: 500nA @ 83.6V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 110V
- Impedance (Max) (Zzt): 450 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
- Current - Reverse Leakage @ Vr: 500nA @ 11.4V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 15V
- Impedance (Max) (Zzt): 14 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 100nA @ 56V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 75V
- Impedance (Max) (Zzt): 175 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
- Current - Reverse Leakage @ Vr: 500nA @ 76V
- Tolerance: ±5%
- Power - Max: 1W
- Voltage - Zener (Nom) (Vz): 100V
- Impedance (Max) (Zzt): 350 Ohms
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