-
- Configuration
- Operating Temperature
- Current - Reverse Leakage @ Vr
- Voltage - Forward (Vf) (Max) @ If
- Series
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 200°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
- Current - Reverse Leakage @ Vr: 500nA @ 62.2V
- Tolerance: ±5%
- Power - Max: 5W
- Voltage - Zener (Nom) (Vz): 82V
- Impedance (Max) (Zzt): 65 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 10nA @ 14.4V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 16V
- Impedance (Max) (Zzt): 100 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 200°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
- Current - Reverse Leakage @ Vr: 500nA @ 56V
- Tolerance: ±5%
- Power - Max: 5W
- Voltage - Zener (Nom) (Vz): 75V
- Impedance (Max) (Zzt): 45 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 5µA @ 2V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 5.1V
- Impedance (Max) (Zzt): 17 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 500nA @ 9.9V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 13V
- Impedance (Max) (Zzt): 13 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 75°C
- Package / Case: Die
- Supplier Device Package: Die
- Current - Reverse Leakage @ Vr: 2µA @ 3V
- Tolerance: ±5%
- Voltage - Zener (Nom) (Vz): 6.4V
- Impedance (Max) (Zzt): 200 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 3µA @ 1.5V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 4.3V
- Impedance (Max) (Zzt): 18 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 75µA @ 1V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 2.7V
- Impedance (Max) (Zzt): 30 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 10µA @ 1V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 3.3V
- Impedance (Max) (Zzt): 28 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 10nA @ 20.4V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 27V
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 200°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
- Current - Reverse Leakage @ Vr: 150µA @ 1V
- Tolerance: ±5%
- Power - Max: 5W
- Voltage - Zener (Nom) (Vz): 3.6V
- Impedance (Max) (Zzt): 2.5 Ohms
-
- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -65°C ~ 175°C
- Package / Case: Die
- Supplier Device Package: Die
- Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
- Current - Reverse Leakage @ Vr: 10µA @ 3V
- Tolerance: ±5%
- Power - Max: 500mW
- Voltage - Zener (Nom) (Vz): 5.1V
- Impedance (Max) (Zzt): 1500 Ohms
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