• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 15V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 20V
• Impedance (Max) (Zzt): 25 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10 nA @ 20.46 V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 27V
• Impedance (Max) (Zzt): 150 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 33V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 43V
• Impedance (Max) (Zzt): 93 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 3µA @ 3V
• Tolerance: ±5%
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 2 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 20.6V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 27V
• Impedance (Max) (Zzt): 35 Ohms

• Manufacturer: Microchip Technology
• Series: Military, MIL-PRF-19500/435
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
• Current - Reverse Leakage @ Vr: 50nA @ 11.4V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 15V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±4.83%
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 15 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 22.4V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 25V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 5µA @ 2.5V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 5.6V
• Impedance (Max) (Zzt): 11 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 1V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 3.9V
• Impedance (Max) (Zzt): 22 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 25.08V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 33V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 3µA @ 6V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 8.2V
• Impedance (Max) (Zzt): 4.5 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Tolerance: ±5%
• Voltage - Zener (Nom) (Vz): 8.4V
• Impedance (Max) (Zzt): 25 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±4.83%
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 10 Ohms