- Manufacturer
- Voltage - Peak Reverse (Max)
- Supplier Device Package
-
- Power Dissipation (Max)
- Resistance @ If, F
- Series
| Partnumber | Description | Manufacturer
|
Package / Case
|
Voltage - Peak Reverse (Max)
|
Diode Type
|
Supplier Device Package
|
Operating Temperature
|
Current - Max
|
Capacitance @ Vr, F
|
Power Dissipation (Max)
|
Resistance @ If, F
|
Series
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| HSMS-2802-TR2G | RF DIODE SCHOTTKY 70V SOT23-3 | Broadcom Limited | TO-236-3, SC-59, SOT-23-3 | 70V | Schottky - 1 Pair Series Connection | SOT-23-3 | 150°C (TJ) | 1A | 2pF @ 0V, 1MHz | 35Ohm @ 5mA, 1MHz | ||
| HSMP-3832-TR1 | RF DIODE PIN 200V 250MW SOT23-3 | Broadcom Limited | TO-236-3, SC-59, SOT-23-3 | 200V | PIN - 1 Pair Series Connection | SOT-23-3 | 150°C (TJ) | 1A | 0.3pF @ 50V, 1MHz | 250mW | 1.5Ohm @ 100mA, 100MHz | |
| HSMS-2852-TR1 | RF DIODE SCHOTTKY 2V SOT23-3 | Broadcom Limited | TO-236-3, SC-59, SOT-23-3 | 2V | Schottky - 1 Pair Series Connection | SOT-23-3 | 150°C (TJ) | 0.3pF @ 1V, 1MHz | ||||
| HSMP-3820-TR2G | RF DIODE PIN 50V SOT23-3 | Broadcom Limited | TO-236-3, SC-59, SOT-23-3 | 50V | PIN - Single | SOT-23-3 | 150°C (TJ) | 1A | 0.8pF @ 20V, 1MHz | 600mOhm @ 10mA, 100MHz | ||
| MADP-000402-12530P | DIODE,PIN,SURMOUNT | MACOM Technology Solutions | Die | 100V | PIN - Single | Die | 175°C (TJ) | 250mA | 0.06pF @ 40V, 1MHz | 1W | MADP000402 Surmount™ | |
| MA4P7102F-1072T | RF DIODE PIN 200V 11.5W | MACOM Technology Solutions | 2-SMD | 200V | PIN - Single | -55°C ~ 175°C (TJ) | 11.5W | 500mOhm @ 100mA, 100MHz | ||||
| MMD805-0805 | DIODE,SRD-CHIP-PACKAGE, 0805-2X | MACOM Technology Solutions | 0805 (2012 Metric) | 60V | PIN - Single | 0805-2 | -65°C ~ 175°C | 150mA | 3.56pF @ 6V, 1MHz | MMDx | ||
| MMPN080045 | DIODE,PIN-CHIP, C50 | MACOM Technology Solutions | C50 | 200V | PIN - Single | C50 | 175°C (TJ) | 150mA | ||||
| MP61010-M42 | GAAS PIN HERMETIC PILL | Microchip Technology | 50V | PIN - Single | -55°C ~ 175°C | 50mA | 0.18pF @ 10V, 1MHz | 1Ohm @ 20mA, 1GHz | ||||
| UMX4301B | SI PPIN HERMETIC GLASS AXIAL | Microchip Technology | Axial | Axial | ||||||||
| MG1052-30 | GAAS GUNN EPI UP HERMETIC PILL | Microchip Technology | Stud | 8V | PIN - Single | 140mA | 10 mW | |||||
| GC9952-6LP | SI SCHOTTKY NON HERMETIC PLASTIC | Microchip Technology | 6-UFDFN Exposed Pad | 3V | Schottky - Single | 6-QFN (1.6x1.6) | -55°C ~ 150°C | 0.5pF @ 0V, 1MHz | 15Ohm @ 10mA, 1MHz | |||
| UM7502F | SI PPIN HERMETIC MELF | Microchip Technology | 200V | PIN - Single | -65°C ~ 175°C | 1pF @ 100V, 1MHz | 10W | 1Ohm @ 50mA, 100MHz | ||||
| GMP4233-GM1 | SI PIN NON HERMETIC PLASTIC SMT | Microchip Technology | ||||||||||
| BAP65-02,115 | RF DIODE PIN 30V 715MW SOD523 | NXP USA Inc. | SC-79, SOD-523 | 30V | PIN - Single | SOD-523 | -65°C ~ 150°C (TJ) | 100mA | 0.375pF @ 20V, 1MHz | 715mW | 350mOhm @ 100mA, 100MHz |
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