RF Misc ICs and Modules, RFI and EMI - Contacts, Fingerstock and Gaskets EMI Conductive Adhesive
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- Plating
- Thickness - Overall
- Adhesive
- Plating - Thickness
- Attachment Method
- Series
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- Manufacturer: Parker Chomerics
- Series: CHO-BOND® 584-29
- Type: EMI Conductive Adhesive
- Material: Epoxy, 2 Part
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- Manufacturer: Parker Chomerics
- Series: CHO-BOND® 580-208
- Type: EMI Conductive Adhesive
- Material: Epoxy, 2 Part
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- Manufacturer: Parker Chomerics
- Series: TECKNIT 8116
- Type: EMI Conductive Adhesive
- Material: Epoxy, 2 Part
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- Manufacturer: Parker Chomerics
- Series: CHO-BOND® 360-20
- Type: EMI Conductive Adhesive
- Material: Epoxy, 2 Part
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- Offers in stock:
- 10
- 15
- 50
- 100