• Pitch - Mating
    • Contact Finish - Mating
    • Contact Finish Thickness - Mating
    • Contact Finish - Post
    • Contact Material - Mating
    • Pitch - Post
    • Contact Finish Thickness - Post
    • Contact Material - Post
    • Series
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List Table
Found: 21952
  • 116-43-328-61-001000
    CONN IC SKT DBL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    Info from the market
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  • 28-3518-11
    CONN IC DIP SOCKET 28POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 518
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 28 (2 x 14)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass
    Info from the market
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  • APA-324-T-M
    ADAPTER PLUG
    Samtec Inc.
    • Manufacturer: Samtec Inc.
    • Series: APA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
    • Number of Positions or Pins (Grid): 24 (2 x 12)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Material - Post: Phosphor Bronze
    Info from the market
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  • 44-6574-10
    CONN IC DIP SOCKET ZIF 44POS TIN
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 57
    • Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
    • Number of Positions or Pins (Grid): 44 (2 x 22)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Beryllium Copper
    Info from the market
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  • 121-13-310-41-001000
    CONN IC DIP SOCKET 10POS GOLD
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 121
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Wire Wrap
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 10 (2 x 5)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass Alloy
    Info from the market
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    • Offers in stock:
  • 1-1814642-0
    CONN IC DIP SOCKET 10POS TIN
    TE Connectivity AMP Connectors
    • Manufacturer: TE Connectivity AMP Connectors
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Thermoplastic, Polyester
    • Number of Positions or Pins (Grid): 10 (2 x 5)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 196.9µin (5.00µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 196.9µin (5.00µm)
    • Contact Material - Post: Brass
    Info from the market
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  • 605-91-308-11-480000
    SKT CARRIER LOWPRO
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 605
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Carrier, Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 8 (2 x 4)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
    Info from the market
    • Total warehouses:
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    • Offers in stock:
  • 116-93-316-61-006000
    CONN IC SKT DBL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    Info from the market
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  • 116-47-310-41-006000
    STANDRD SOLDRTL DBL SKT
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 116
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Elevated, Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 10 (2 x 5)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: Flash
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
    Info from the market
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    • Offers in stock:
  • 214-99-308-01-670800
    CONN IC DIP SOCKET 8POS TIN-LEAD
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 214
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Closed Frame
    • Mounting Type: Surface Mount
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 8 (2 x 4)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin-Lead
    • Contact Finish Thickness - Mating: 100.0µin (2.54µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • 510-93-153-15-061003
    SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 510
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 153 (15 x 15)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
    Info from the market
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  • 20-3513-11H
    CONN IC DIP SOCKET 20POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: Lo-PRO®file, 513
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 20 (2 x 10)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass
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  • 511-93-156-15-061002
    SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 511
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 156 (15 x 15)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • 115-87-424-41-001101
    CONN IC DIP SOCKET 24POS GOLD
    Preci-Dip
    • Manufacturer: Preci-Dip
    • Series: 115
    • Type: DIP, 0.4" (10.16mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
    • Number of Positions or Pins (Grid): 24 (2 x 12)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: Flash
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Material - Post: Brass
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  • 523-13-100-13-062003
    SKT PGA WRAPOST
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 523
    • Type: PGA
    • Mounting Type: Through Hole
    • Termination: Wire Wrap
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 100 (13 x 13)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    Info from the market
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