Found: 21952
  • SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 511
    • Type: PGA
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 49 (7 x 7)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass Alloy
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  • SKT PGA WRAPOST
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 523
    • Type: PGA
    • Mounting Type: Through Hole
    • Termination: Wire Wrap
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 324 (18 x 18)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
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  • CONN IC SKT DBL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
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  • CONN SOCKET PLCC 44POS TIN
    3M
    • Manufacturer: 3M
    • Series: 8400
    • Type: PLCC
    • Features: Closed Frame
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
    • Number of Positions or Pins (Grid): 44 (4 x 11)
    • Pitch - Mating: 0.050" (1.27mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 160.0µin (4.06µm)
    • Contact Material - Mating: Copper Alloy
    • Pitch - Post: 0.050" (1.27mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 160.0µin (4.06µm)
    • Contact Material - Post: Copper Alloy
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  • CONN IC DIP SOCKET 14POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 8
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Closed Frame, Elevated
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 14 (2 x 7)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass
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  • 510-AG92D-08=INLINE SOCKET
    TE Connectivity AMP Connectors
    • Manufacturer: TE Connectivity AMP Connectors
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  • CONN IC DIP SOCKET 32POS GOLD
    TE Connectivity AMP Connectors
    • Manufacturer: TE Connectivity AMP Connectors
    • Series: 800
    • Type: DIP, 0.6" (15.24mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polyester
    • Number of Positions or Pins (Grid): 32 (2 x 16)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 5.00µin (0.127µm)
    • Contact Material - Mating: Copper Alloy
    • Pitch - Post: 0.100" (2.54mm)
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  • CONN IC DIP SOCKET 28POS GOLD
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 111
    • Type: DIP, 0.6" (15.24mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 28 (2 x 14)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN TRANSIST TO-262 3POS GOLD
    Sullins Connector Solutions
    • Manufacturer: Sullins Connector Solutions
    • Type: Transistor, TO-262
    • Mounting Type: Through Hole
    • Operating Temperature: -50°C ~ 175°C
    • Termination: Solder
    • Housing Material: Polyphenylene Sulfide (PPS)
    • Number of Positions or Pins (Grid): 3 (Rectangular)
    • Pitch - Mating: 0.150" (3.81mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.150" (3.81mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 30.0µin (0.76µm)
    • Contact Material - Post: Beryllium Copper
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  • SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 510
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 181 (15 x 15)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Material - Post: Brass Alloy
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  • CONN IC DIP SOCKET 24POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 518
    • Type: DIP, 0.6" (15.24mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 24 (2 x 12)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass
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  • SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 515
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 223 (18 x 18)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass Alloy
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  • CONN SOCKET SIP 5POS TIN
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 700 Elevator Strip-Line™
    • Type: SIP
    • Features: Elevated
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 5 (1 x 5)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Phosphor Bronze
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  • CONN HDR SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 551
    • Type: PGA
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 323 (21 x 21)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin-Lead
    • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN HDR SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 551
    • Type: PGA
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 72 (11 x 11)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass Alloy
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