Found: 21952
  • IC PLCC SOCKET 84POS TIN
    Assmann WSW Components
    • Manufacturer: Assmann WSW Components
    • Type: PLCC
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -40°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polybutylene Terephthalate (PBT)
    • Number of Positions or Pins (Grid): 84 (4 x 21)
    • Pitch - Mating: 0.050" (1.27mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 160.0µin (4.06µm)
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 160.0µin (4.06µm)
    • Contact Material - Post: Phosphor Bronze
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  • CONN IC DIP SOCKET 6POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 508
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Wire Wrap
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 6 (2 x 3)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass
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  • CONN IC DIP SOCKET 14POS GOLD
    Aries Electronics
    • Manufacturer: Aries Electronics
    • Series: 508
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Wire Wrap
    • Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
    • Number of Positions or Pins (Grid): 14 (2 x 7)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: 10.0µin (0.25µm)
    • Contact Material - Post: Brass
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  • CONN SOCKET PGA 192POS GOLD
    Preci-Dip
    • Manufacturer: Preci-Dip
    • Series: 518
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Surface Mount
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: FR4 Epoxy Glass
    • Number of Positions or Pins (Grid): 192 (16 x 16)
    • Pitch - Mating: 0.050" (1.27mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: Flash
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.050" (1.27mm)
    • Contact Finish - Post: Gold
    • Contact Finish Thickness - Post: Flash
    • Contact Material - Post: Brass
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  • CONN IC DIP SOCKET 40POS GOLD
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 114
    • Type: DIP, 0.6" (15.24mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Surface Mount
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 40 (2 x 20)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN HDR SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 551
    • Type: PGA
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 225 (15 x 15)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin-Lead
    • Contact Finish Thickness - Mating: 200.0µin (5.08µm)
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • SOCKET SOLDERTAIL 256-PGA
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 510
    • Type: PGA
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 256 (16 x 16)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Material - Post: Brass Alloy
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  • CONN IC SKT DBL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
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  • SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 511
    • Type: PGA
    • Features: Closed Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 81 (9 x 9)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • ADAPTER PLUG
    Samtec Inc.
    • Manufacturer: Samtec Inc.
    • Series: APA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Termination: Solder
    • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
    • Number of Positions or Pins (Grid): 20 (2 x 10)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Tin
    • Contact Material - Mating: Phosphor Bronze
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Material - Post: Phosphor Bronze
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  • CONN SOCKET PLCC 68POS TIN
    3M
    • Manufacturer: 3M
    • Series: 8400
    • Type: PLCC
    • Features: Closed Frame
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 105°C
    • Termination: Solder
    • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
    • Number of Positions or Pins (Grid): 68 (4 x 17)
    • Pitch - Mating: 0.050" (1.27mm)
    • Contact Finish - Mating: Tin
    • Contact Finish Thickness - Mating: 160.0µin (4.06µm)
    • Contact Material - Mating: Copper Alloy
    • Pitch - Post: 0.050" (1.27mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 160.0µin (4.06µm)
    • Contact Material - Post: Copper Alloy
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  • SKT CARRIER PGA
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 614
    • Type: DIP, 0.4" (10.16mm) Row Spacing
    • Features: Carrier, Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 20 (2 x 10)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 10.0µin (0.25µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • SKT PGA SOLDRTL
    Mill-Max Manufacturing Corp.
    • Manufacturer: Mill-Max Manufacturing Corp.
    • Series: 511
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
    • Number of Positions or Pins (Grid): 256 (19 x 19)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin-Lead
    • Contact Finish Thickness - Post: 200.0µin (5.08µm)
    • Contact Material - Post: Brass Alloy
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  • CONN SOCKET PGA 176POS GOLD
    Preci-Dip
    • Manufacturer: Preci-Dip
    • Series: 510
    • Type: PGA
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
    • Number of Positions or Pins (Grid): 176 (16 x 16)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: Flash
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Material - Post: Brass
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  • CONN IC DIP SOCKET 8POS GOLD
    Preci-Dip
    • Manufacturer: Preci-Dip
    • Series: 115
    • Type: DIP, 0.3" (7.62mm) Row Spacing
    • Features: Open Frame
    • Mounting Type: Through Hole
    • Operating Temperature: -55°C ~ 125°C
    • Termination: Solder
    • Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
    • Number of Positions or Pins (Grid): 8 (2 x 4)
    • Pitch - Mating: 0.100" (2.54mm)
    • Contact Finish - Mating: Gold
    • Contact Finish Thickness - Mating: Flash
    • Contact Material - Mating: Beryllium Copper
    • Pitch - Post: 0.100" (2.54mm)
    • Contact Finish - Post: Tin
    • Contact Material - Post: Brass
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