-
- Pitch - Mating
- Contact Finish - Mating
- Contact Finish Thickness - Mating
- Contact Finish - Post
- Contact Material - Mating
- Pitch - Post
- Contact Finish Thickness - Post
- Contact Material - Post
- Series
-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 126
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Wire Wrap
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Mill-Max Manufacturing Corp.
Info from the market- Total warehouses:
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 116
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Features: Elevated, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 52 (2 x 26)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Aries Electronics
- Series: 508
- Type: SIP
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Wire Wrap
- Housing Material: Polyamide (PA46), Nylon 4/6
- Number of Positions or Pins (Grid): 27 (1 x 27)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 146
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Press-Fit
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 6 (2 x 3)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: TE Connectivity AMP Connectors
- Series: Diplomate DL
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Thermoplastic, Glass Filled
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 30.0µin (0.76µm)
- Contact Material - Post: Beryllium Copper
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-
- Manufacturer: Mill-Max Manufacturing Corp.
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- Manufacturer: Aries Electronics
- Series: Lo-PRO®file, 513
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 10 (2 x 5)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 522
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Wire Wrap
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 97 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 114
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Open Frame
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 28 (2 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 346
- Type: SIP
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Press-Fit
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 50 (1 x 50)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Aries Electronics
- Series: 700 Elevator Strip-Line™
- Type: SIP
- Features: Elevated
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 26 (1 x 26)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
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- Manufacturer: Preci-Dip
- Series: 299
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole, Right Angle, Horizontal
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Number of Positions or Pins (Grid): 16 (2 x 8)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Material - Post: Brass
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-
- Manufacturer: Aries Electronics
- Series: 518
- Type: DIP, 0.2" (5.08mm) Row Spacing
- Features: Open Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 38 (2 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
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- Manufacturer: TE Connectivity AMP Connectors
- Series: 8059
- Type: Transistor, TO-5
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polyamide (PA), Nylon, Glass Filled
- Number of Positions or Pins (Grid): 4 (Round)
- Contact Finish - Mating: Gold
- Contact Material - Mating: Beryllium Copper
- Contact Finish - Post: Gold
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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- Offers with a price:
- Offers in stock:
- 10
- 15
- 50
- 100