-
- Pitch - Mating
- Contact Finish - Mating
- Contact Finish Thickness - Mating
- Contact Finish - Post
- Contact Material - Mating
- Pitch - Post
- Contact Finish Thickness - Post
- Contact Material - Post
- Series
-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 511
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 85 (13 x 13)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
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- Offers in stock:
-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 605
- Type: DIP, 0.9" (22.86mm) Row Spacing
- Features: Carrier, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 64 (2 x 32)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Aries Electronics
- Series: 700 Elevator Strip-Line™
- Type: SIP
- Features: Elevated
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 20 (1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 551
- Type: PGA
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 223 (18 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
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-
- Manufacturer: Preci-Dip
- Series: 612
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Carrier, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Number of Positions or Pins (Grid): 32 (2 x 16)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 29.5µin (0.75µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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-
- Manufacturer: Aries Electronics
- Series: Lo-PRO®file, 513
- Type: DIP, 0.6" (15.24mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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- Manufacturer: Aries Electronics
- Series: Vertisockets™ 800
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole, Right Angle, Horizontal
- Operating Temperature: -55°C ~ 105°C
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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- Manufacturer: TE Connectivity AMP Connectors
- Type: PGA, ZIF (ZIP)
- Features: Open Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Liquid Crystal Polymer (LCP)
- Number of Positions or Pins (Grid): 370 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Copper Alloy
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: Flash
- Contact Material - Post: Copper Alloy
Info from the market- Total warehouses:
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-
- Manufacturer: Preci-Dip
- Series: 116
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Elevated, Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 29.5µin (0.75µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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-
- Manufacturer: Aries Electronics
- Series: 501
- Type: SIP
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Wire Wrap
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 20 (1 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 614
- Type: PGA
- Features: Carrier, Open Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 299 (20 x 20)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
Info from the market- Total warehouses:
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-
- Manufacturer: Aries Electronics
- Series: 8
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Features: Closed Frame, Elevated
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 111
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 20 (2 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 515
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 223 (18 x 18)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 515
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 209 (17 x 17)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
- 10
- 15
- 50
- 100