-
- Pitch - Mating
- Contact Finish - Mating
- Contact Finish Thickness - Mating
- Contact Finish - Post
- Contact Material - Mating
- Pitch - Post
- Contact Finish Thickness - Post
- Contact Material - Post
- Series
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 110
- Type: DIP, 0.4" (10.16mm) Row Spacing
- Features: Open Frame, Decoupling Capacitor
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 22 (2 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 511
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 97 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 515
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 92 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin-Lead
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass Alloy
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- Manufacturer: Aries Electronics
- Series: Vertisockets™ 800
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole, Right Angle, Vertical
- Termination: Solder
- Housing Material: Polyamide (PA46), Nylon 4/6
- Number of Positions or Pins (Grid): 14 (2 x 7)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Phosphor Bronze
Info from the market- Total warehouses:
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- Manufacturer: Mill-Max Manufacturing Corp.
Info from the market- Total warehouses:
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- Manufacturer: Aries Electronics
- Series: 501
- Type: DIP, 0.3" (7.62mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Wire Wrap
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 8 (2 x 4)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
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- Manufacturer: Preci-Dip
- Series: 558
- Type: BGA
- Features: Closed Frame
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: FR4 Epoxy Glass
- Number of Positions or Pins (Grid): 400 (20 x 20)
- Pitch - Mating: 0.050" (1.27mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Brass
- Pitch - Post: 0.050" (1.27mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 511
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 73 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
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- Manufacturer: Amphenol ICC (FCI)
- Series: SIP1x
- Type: SIP
- Features: Closed Frame
- Mounting Type: Through Hole
- Termination: Solder
- Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
- Number of Positions or Pins (Grid): 14 (1 x 14)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 510
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 68 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
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- Manufacturer: Aries Electronics
- Series: 55
- Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
- Features: Closed Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 250°C
- Termination: Solder
- Housing Material: Polyetheretherketone (PEEK), Glass Filled
- Number of Positions or Pins (Grid): 48 (2 x 24)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Nickel Boron
- Contact Finish Thickness - Mating: 50.0µin (1.27µm)
- Contact Material - Mating: Beryllium Nickel
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Nickel Boron
- Contact Finish Thickness - Post: 50.0µin (1.27µm)
- Contact Material - Post: Beryllium Nickel
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- Manufacturer: Omron Electronics Inc-EMC Div
- Series: XR2
- Type: SIP
- Mounting Type: Threaded
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
- Number of Positions or Pins (Grid): 10 (1 x 10)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 10.0µin (0.25µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass
Info from the market- Total warehouses:
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- Offers in stock:
-
- Manufacturer: Mill-Max Manufacturing Corp.
Info from the market- Total warehouses:
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- Offers with a price:
- Offers in stock:
-
- Manufacturer: Aries Electronics
- Series: 501
- Type: SIP
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 105°C
- Termination: Wire Wrap
- Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
- Number of Positions or Pins (Grid): 26 (1 x 26)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Tin
- Contact Finish Thickness - Mating: 200.0µin (5.08µm)
- Contact Material - Mating: Phosphor Bronze
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: 200.0µin (5.08µm)
- Contact Material - Post: Phosphor Bronze
Info from the market- Total warehouses:
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- Offers in stock:
-
- Manufacturer: Mill-Max Manufacturing Corp.
- Series: 515
- Type: PGA
- Features: Open Frame
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 125°C
- Termination: Solder
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
- Number of Positions or Pins (Grid): 85 (11 x 11)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: 30.0µin (0.76µm)
- Contact Material - Mating: Beryllium Copper
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Gold
- Contact Finish Thickness - Post: 10.0µin (0.25µm)
- Contact Material - Post: Brass Alloy
Info from the market- Total warehouses:
- Total offers:
- Offers with a price:
- Offers in stock:
- 10
- 15
- 50
- 100