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B39431R806H210
|
SAW RES 433.4200MHZ 2.4PF SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.42MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
Built in Capacitor |
0.197" L x 0.138" W (5.00mm x 3.50mm) |
2.4pF |
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
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B39431 |
|
B39421R714U310
|
SAW RES 423.2200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
423.22MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 120°C |
50 Ohms |
|
|
B39421 |
|
B39301R2707U310
|
SAW RES 303.8250MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
303.825MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 85°C |
50 Ohms |
|
|
B39301 |
|
B39391R882H210
|
SAW RES 390.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
390MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39391 |
|
B39351R802H210
|
SAW RES 345.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
345MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39351 |
|
B39431R0990H110
|
SAW RES SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
|
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
|
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B39431 |
|
B39801R2712U310
|
SAW RES 804.5000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
804.5MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 125°C |
50 Ohms |
|
|
B39801 |
|
B39431R0820H210
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.92MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39921R2906H110
|
SAW RES 915.0000MHZ 1.8PF SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
915MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
Without Capacitor |
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-40°C ~ 125°C |
|
|
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B39921 |
|
B39321R0821H210
|
SAW RES 315.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
315MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
Without Capacitor |
0.197" L x 0.138" W (5.00mm x 3.50mm) |
2.8pF |
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39321 |
|
B39431R723U310
|
SAW RES 434.4200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
434.42MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 85°C |
50 Ohms |
|
|
B39431 |
|
B39431R0880H210
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.92MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39431R0962H110
|
SAW RES 433.9500MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.95MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39421R2702U310
|
SAW RES 418.0500MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
418.05MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 85°C |
50 Ohms |
|
|
B39421 |
|
B39871R0808H210
|
SAW RES SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
|
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
|
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