- Производитель
- Частота
- Вид монтажа
- Тип
-
- Высота
- Рабочая температура
- Импеданс
- Frequency Stability
- Frequency Tolerance
- Серия
| Наименование | Описание | Производитель
|
Частота
|
Package / Case
|
Вид монтажа
|
Тип
|
Features
|
Размеры
|
Ёмкость
|
Высота
|
Рабочая температура
|
Импеданс
|
Frequency Stability
|
Frequency Tolerance
|
Серия
|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| B39311R884H210 | SAW RES 310.0000MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 310MHz | 8-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) | -40°C ~ 125°C | 50 Ohms | B39311 | ||||
| B39321R0822H210 | SAW RES 319.5080MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 319.508MHz | 8-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) | -40°C ~ 125°C | 50 Ohms | B39321 | ||||
| B39431R0920H110 | SAW RES 433.9200MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 433.92MHz | 6-SMD, No Lead | Surface Mount | SAW | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.043" (1.09mm) | -40°C ~ 125°C | 50 Ohms | B39431 | ||||
| B39431R856H210 | SAW RES SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 4-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) | B39431 | |||||||
| B39311R2710U310 | SAW RES 311.0630MHZ 1.8PF SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 311.063MHz | 8-SMD, No Lead | Surface Mount | SAW | Built in Capacitor | 0.197" L x 0.197" W (5.00mm x 5.00mm) | 1.8pF | 0.053" (1.35mm) | -45°C ~ 85°C | 50 Ohms | B39311 | ||
| B39431R0964H110 | SAW RES 434.1500MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 434.15MHz | 6-SMD, No Lead | Surface Mount | SAW | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.039" (1.00mm) | -40°C ~ 125°C | 50 Ohms | ±50ppm | B39431 | |||
| B39431R715U310 | SAW RES 433.3200MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 433.32MHz | 8-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.197" W (5.00mm x 5.00mm) | 0.053" (1.35mm) | -45°C ~ 85°C | 50 Ohms | B39431 | ||||
| B39871R2709U310 | SAW RES 868.3000MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 868.3MHz | 8-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.197" W (5.00mm x 5.00mm) | 0.053" (1.35mm) | -45°C ~ 125°C | B39871 | |||||
| B39431R0950U410 | SAW RES 433.9600MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 433.96MHz | 6-SMD, No Lead | Surface Mount | SAW | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.043" (1.09mm) | -40°C ~ 125°C | 50 Ohms | B39431 | ||||
| B39431R971H110 | SAW RES SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 4-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) | B39431 | |||||||
| B39431R732U310 | SAW RES 433.9600MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 433.96MHz | 8-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.197" W (5.00mm x 5.00mm) | 0.053" (1.35mm) | -45°C ~ 125°C | 50 Ohms | B39431 | ||||
| B39321R883H210 | SAW RES 315.1500MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 315.15MHz | 4-SMD, No Lead | Surface Mount | SAW | 0.197" L x 0.138" W (5.00mm x 3.50mm) | 0.057" (1.45mm) | -40°C ~ 125°C | 50 Ohms | B39321 | ||||
| B39311R0994H110 | SAW RES 314.9000MHZ SMD | Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) | 314.9MHz | 6-SMD, No Lead | Surface Mount | SAW | 0.118" L x 0.118" W (3.00mm x 3.00mm) | 0.039" (1.00mm) | -45°C ~ 125°C | 50 Ohms | ±50ppm | R994 |
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