|
B39311R884H210
|
SAW RES 310.0000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
310MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39311 |
|
B39321R0822H210
|
SAW RES 319.5080MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
319.508MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39321 |
|
B39431R0920H110
|
SAW RES 433.9200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.92MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.043" (1.09mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39431R856H210
|
SAW RES SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
|
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
|
|
|
|
B39431 |
|
B39311R2710U310
|
SAW RES 311.0630MHZ 1.8PF SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
311.063MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
Built in Capacitor |
0.197" L x 0.197" W (5.00mm x 5.00mm) |
1.8pF |
0.053" (1.35mm) |
-45°C ~ 85°C |
50 Ohms |
|
|
B39311 |
|
B39431R0964H110
|
SAW RES 434.1500MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
434.15MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-40°C ~ 125°C |
50 Ohms |
±50ppm |
|
B39431 |
|
B39431R715U310
|
SAW RES 433.3200MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.32MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 85°C |
50 Ohms |
|
|
B39431 |
|
B39871R2709U310
|
SAW RES 868.3000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
868.3MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 125°C |
|
|
|
B39871 |
|
B39431R0950U410
|
SAW RES 433.9600MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.96MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.043" (1.09mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39431R971H110
|
SAW RES SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
|
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
|
|
|
|
B39431 |
|
B39431R732U310
|
SAW RES 433.9600MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
433.96MHz |
8-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.197" W (5.00mm x 5.00mm) |
|
0.053" (1.35mm) |
-45°C ~ 125°C |
50 Ohms |
|
|
B39431 |
|
B39321R883H210
|
SAW RES 315.1500MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
315.15MHz |
4-SMD, No Lead |
Surface Mount |
SAW |
|
0.197" L x 0.138" W (5.00mm x 3.50mm) |
|
0.057" (1.45mm) |
-40°C ~ 125°C |
50 Ohms |
|
|
B39321 |
|
B39311R0994H110
|
SAW RES 314.9000MHZ SMD |
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) |
314.9MHz |
6-SMD, No Lead |
Surface Mount |
SAW |
|
0.118" L x 0.118" W (3.00mm x 3.00mm) |
|
0.039" (1.00mm) |
-45°C ~ 125°C |
50 Ohms |
±50ppm |
|
R994 |