- Manufacturer
- Supplier Device Package
- Power - Output
- Voltage - Rated
-
- Package / Case
- Transistor Type
- Technology
- Operating Temperature
- FET Type
- Gain
- Noise Figure
- Power Dissipation (Max)
- Drain to Source Voltage (Vdss)
- Voltage - Test
- Current - Test
- Current - Continuous Drain (Id) @ 25°C
- FET Feature
- Rds On (Max) @ Id, Vgs
- Drive Voltage (Max Rds On, Min Rds On)
- Vgs(th) (Max) @ Id
- Gate Charge (Qg) (Max) @ Vgs
- Input Capacitance (Ciss) (Max) @ Vds
- Vgs (Max)
- Series
-
- Manufacturer: Microchip Technology
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-226-3, TO-92-3 (TO-226AA) (Formed Leads)
- Supplier Device Package: TO-92-3
- FET Type: N-Channel
- Drain to Source Voltage (Vdss): 60V
- Current - Continuous Drain (Id) @ 25°C: 310mA (Tj)
- Rds On (Max) @ Id, Vgs: 5Ohm @ 500mA, 10V
- Vgs(th) (Max) @ Id: 2.5V @ 1mA
- Input Capacitance (Ciss) (Max) @ Vds: 60pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 1W (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs (Max): ±30V
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- Manufacturer: Microchip Technology
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 175°C (TJ)
- Package / Case: Module
- Supplier Device Package: SP3F
- FET Type: 4 N-Channel
- FET Feature: Silicon Carbide (SiC)
- Drain to Source Voltage (Vdss): 1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C: 89A (Tc)
- Rds On (Max) @ Id, Vgs: 31mOhm @ 40A, 20V
- Vgs(th) (Max) @ Id: 2.8V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs: 232nC @ 20V
- Input Capacitance (Ciss) (Max) @ Vds: 3020pF @ 1000V
- Power - Max: 395W (Tc)
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- Manufacturer: Microchip Technology
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 175°C (TJ)
- Package / Case: Module
- Supplier Device Package: D3
- FET Type: 2 N Channel (Phase Leg)
- FET Feature: Silicon Carbide (SiC)
- Drain to Source Voltage (Vdss): 1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C: 495A (Tc)
- Rds On (Max) @ Id, Vgs: 5.2mOhm @ 240A, 20V
- Vgs(th) (Max) @ Id: 2.8V @ 6mA
- Gate Charge (Qg) (Max) @ Vgs: 1392nC @ 20V
- Input Capacitance (Ciss) (Max) @ Vds: 18.1pF @ 1000V
- Power - Max: 2.031kW (Tc)
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- Manufacturer: Microchip Technology
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: SP6
- Supplier Device Package: SP6
- FET Type: 4 N-Channel (Half Bridge)
- FET Feature: Standard
- Drain to Source Voltage (Vdss): 500V
- Current - Continuous Drain (Id) @ 25°C: 90A
- Rds On (Max) @ Id, Vgs: 45mOhm @ 45A, 10V
- Vgs(th) (Max) @ Id: 5V @ 5mA
- Gate Charge (Qg) (Max) @ Vgs: 246nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 11200pF @ 25V
- Power - Max: 694W
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- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-236-3, SC-59, SOT-23-3
- Supplier Device Package: SOT-23-3 (TO-236)
- FET Type: N-Channel
- FET Feature: Depletion Mode
- Drain to Source Voltage (Vdss): 350V
- Current - Continuous Drain (Id) @ 25°C: 72mA (Tj)
- Rds On (Max) @ Id, Vgs: 35Ohm @ 150mA, 0V
- Input Capacitance (Ciss) (Max) @ Vds: 120pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 360mW (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 0V
- Vgs (Max): ±20V
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- Manufacturer: Microchip Technology
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
- FET Type: P-Channel
- Drain to Source Voltage (Vdss): 500V
- Current - Continuous Drain (Id) @ 25°C: 100mA (Tj)
- Rds On (Max) @ Id, Vgs: 30Ohm @ 100mA, 10V
- Vgs(th) (Max) @ Id: 3.5V @ 1mA
- Input Capacitance (Ciss) (Max) @ Vds: 190pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 740mW (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
- Vgs (Max): ±20V
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- Manufacturer: Microchip Technology
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: SP1
- Supplier Device Package: SP1
- FET Type: 2 N-Channel (Half Bridge)
- FET Feature: Silicon Carbide (SiC)
- Drain to Source Voltage (Vdss): 1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
- Rds On (Max) @ Id, Vgs: 49mOhm @ 40A, 20V
- Vgs(th) (Max) @ Id: 2.2V @ 2mA (Typ)
- Gate Charge (Qg) (Max) @ Vgs: 98nC @ 20V
- Input Capacitance (Ciss) (Max) @ Vds: 1900pF @ 1000V
- Power - Max: 250W
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- Manufacturer: Microchip Technology
- Series: CoolMOS™
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: SP1
- Supplier Device Package: SP1
- FET Type: 3 N Channel (Phase Leg + Boost Chopper)
- FET Feature: Standard
- Drain to Source Voltage (Vdss): 600V
- Current - Continuous Drain (Id) @ 25°C: 49A
- Rds On (Max) @ Id, Vgs: 45mOhm @ 24.5A, 10V
- Vgs(th) (Max) @ Id: 3.9V @ 3mA
- Gate Charge (Qg) (Max) @ Vgs: 150nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 7200pF @ 25V
- Power - Max: 250W
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- Manufacturer: Microchip Technology
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 175°C (TJ)
- Package / Case: Module
- Supplier Device Package: SP6-P
- FET Type: 6 N-Channel (3-Phase Bridge)
- FET Feature: Silicon Carbide (SiC)
- Drain to Source Voltage (Vdss): 1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C: 251A (Tc)
- Rds On (Max) @ Id, Vgs: 10.4mOhm @ 120A, 20V
- Vgs(th) (Max) @ Id: 2.8V @ 3mA
- Gate Charge (Qg) (Max) @ Vgs: 696nC @ 20V
- Input Capacitance (Ciss) (Max) @ Vds: 9060pF @ 1000V
- Power - Max: 1.042kW (Tc)
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- Manufacturer: Microchip Technology
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
- FET Type: N-Channel
- FET Feature: Depletion Mode
- Drain to Source Voltage (Vdss): 500V
- Current - Continuous Drain (Id) @ 25°C: 30mA (Tj)
- Rds On (Max) @ Id, Vgs: 1000Ohm @ 500µA, 0V
- Input Capacitance (Ciss) (Max) @ Vds: 10pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 740mW (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 0V
- Vgs (Max): ±20V
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- Manufacturer: Microchip Technology
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
- FET Type: N-Channel
- Drain to Source Voltage (Vdss): 100V
- Current - Continuous Drain (Id) @ 25°C: 500mA (Tj)
- Rds On (Max) @ Id, Vgs: 1.5Ohm @ 750mA, 10V
- Vgs(th) (Max) @ Id: 2V @ 1mA
- Input Capacitance (Ciss) (Max) @ Vds: 150pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 1W (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 3V, 10V
- Vgs (Max): ±20V
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- Manufacturer: Microchip Technology
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
- FET Type: N-Channel
- Drain to Source Voltage (Vdss): 60V
- Current - Continuous Drain (Id) @ 25°C: 230mA (Tj)
- Rds On (Max) @ Id, Vgs: 7.5Ohm @ 500mA, 10V
- Vgs(th) (Max) @ Id: 2.5V @ 250µA
- Input Capacitance (Ciss) (Max) @ Vds: 50pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 1W (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs (Max): ±30V
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- Manufacturer: Microchip Technology
- Mounting Type: Through Hole
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-226-3, TO-92-3 (TO-226AA)
- Supplier Device Package: TO-92-3
- FET Type: P-Channel
- Drain to Source Voltage (Vdss): 500V
- Current - Continuous Drain (Id) @ 25°C: 54mA (Tj)
- Rds On (Max) @ Id, Vgs: 125Ohm @ 10mA, 10V
- Vgs(th) (Max) @ Id: 4.5V @ 1mA
- Input Capacitance (Ciss) (Max) @ Vds: 70pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 1W (Tc)
- Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
- Vgs (Max): ±20V
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- Manufacturer: Microchip Technology
- Mounting Type: Surface Mount
- Operating Temperature: -55°C ~ 150°C (TJ)
- Package / Case: TO-243AA
- Supplier Device Package: TO-243AA (SOT-89)
- FET Type: N-Channel
- FET Feature: Depletion Mode
- Drain to Source Voltage (Vdss): 250V
- Current - Continuous Drain (Id) @ 25°C: 360mA (Tj)
- Rds On (Max) @ Id, Vgs: 6Ohm @ 200mA, 0V
- Input Capacitance (Ciss) (Max) @ Vds: 350pF @ 25V
- Technology: MOSFET (Metal Oxide)
- Power Dissipation (Max): 1.6W (Ta)
- Drive Voltage (Max Rds On, Min Rds On): 0V
- Vgs (Max): ±20V
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- Manufacturer: Microchip Technology
- Series: POWER MOS 7®
- Mounting Type: Chassis Mount
- Operating Temperature: -40°C ~ 150°C (TJ)
- Package / Case: SP4
- Supplier Device Package: SP4
- FET Type: 4 N-Channel (Half Bridge)
- FET Feature: Standard
- Drain to Source Voltage (Vdss): 1000V (1kV)
- Current - Continuous Drain (Id) @ 25°C: 18A
- Rds On (Max) @ Id, Vgs: 540mOhm @ 9A, 10V
- Vgs(th) (Max) @ Id: 5V @ 2.5mA
- Gate Charge (Qg) (Max) @ Vgs: 154nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds: 4350pF @ 25V
- Power - Max: 357W
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- 10
- 15
- 50
- 100