• Manufacturer
  • Supplier Device Package
  • Power - Output
  • Voltage - Rated
    • Package / Case
    • Transistor Type
    • Technology
    • Operating Temperature
    • FET Type
    • Gain
    • Noise Figure
    • Power Dissipation (Max)
    • Drain to Source Voltage (Vdss)
    • Voltage - Test
    • Current - Test
    • Current - Continuous Drain (Id) @ 25°C
    • FET Feature
    • Rds On (Max) @ Id, Vgs
    • Drive Voltage (Max Rds On, Min Rds On)
    • Vgs(th) (Max) @ Id
    • Gate Charge (Qg) (Max) @ Vgs
    • Input Capacitance (Ciss) (Max) @ Vds
    • Vgs (Max)
    • Series
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List Table
Found: 74
  • EPC2104
    GAN TRANS SYMMETRICAL HALF BRIDG
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: 2 N-Channel (Half Bridge)
    • FET Feature: GaNFET (Gallium Nitride)
    • Drain to Source Voltage (Vdss): 100V
    • Current - Continuous Drain (Id) @ 25°C: 23A
    • Rds On (Max) @ Id, Vgs: 6.3mOhm @ 20A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 5.5mA
    • Gate Charge (Qg) (Max) @ Vgs: 7nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 800pF @ 50V
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  • EPC2110ENGRT
    GAN TRANS 2N-CH 120V BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: 2 N-Channel (Dual) Common Source
    • FET Feature: GaNFET (Gallium Nitride)
    • Drain to Source Voltage (Vdss): 120V
    • Current - Continuous Drain (Id) @ 25°C: 3.4A
    • Rds On (Max) @ Id, Vgs: 60mOhm @ 4A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 700µA
    • Gate Charge (Qg) (Max) @ Vgs: 0.8nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 80pF @ 60V
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  • EPC2030
    GANFET NCH 40V 31A DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 40V
    • Current - Continuous Drain (Id) @ 25°C: 31A (Ta)
    • Rds On (Max) @ Id, Vgs: 2.4mOhm @ 30A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 16mA
    • Gate Charge (Qg) (Max) @ Vgs: 18nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 1900pF @ 20V
    • Technology: GaNFET (Gallium Nitride)
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  • EPC2036
    GANFET TRANS 100V 1A BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 100V
    • Current - Continuous Drain (Id) @ 25°C: 1.7A (Ta)
    • Rds On (Max) @ Id, Vgs: 65mOhm @ 1A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 600µA
    • Gate Charge (Qg) (Max) @ Vgs: 0.91nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 90pF @ 50V
    • Technology: GaNFET (Gallium Nitride)
    • Drive Voltage (Max Rds On, Min Rds On): 5V
    • Vgs (Max): +6V, -4V
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  • EPC8002
    GANFET TRANS 65V 2.7A BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 65V
    • Current - Continuous Drain (Id) @ 25°C: 2A (Ta)
    • Rds On (Max) @ Id, Vgs: 530mOhm @ 500mA, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 250µA
    • Input Capacitance (Ciss) (Max) @ Vds: 21pF @ 32.5V
    • Technology: GaNFET (Gallium Nitride)
    • Drive Voltage (Max Rds On, Min Rds On): 5V
    • Vgs (Max): +6V, -4V
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  • EPC2012C
    GANFET TRANS 200V 5A BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die Outline (4-Solder Bar)
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 200V
    • Current - Continuous Drain (Id) @ 25°C: 5A (Ta)
    • Rds On (Max) @ Id, Vgs: 100mOhm @ 3A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 1mA
    • Gate Charge (Qg) (Max) @ Vgs: 1.3nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 140pF @ 100V
    • Technology: GaNFET (Gallium Nitride)
    • Drive Voltage (Max Rds On, Min Rds On): 5V
    • Vgs (Max): +6V, -4V
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  • EPC2103
    GAN TRANS SYMMETRICAL HALF BRIDG
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: 2 N-Channel (Half Bridge)
    • FET Feature: GaNFET (Gallium Nitride)
    • Drain to Source Voltage (Vdss): 80V
    • Current - Continuous Drain (Id) @ 25°C: 28A
    • Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 7mA
    • Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 760pF @ 40V
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  • EPC2102
    GAN TRANS SYMMETRICAL HALF BRIDG
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: 2 N-Channel (Half Bridge)
    • FET Feature: GaNFET (Gallium Nitride)
    • Drain to Source Voltage (Vdss): 60V
    • Current - Continuous Drain (Id) @ 25°C: 23A
    • Rds On (Max) @ Id, Vgs: 4.4mOhm @ 20A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 7mA
    • Gate Charge (Qg) (Max) @ Vgs: 6.8nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 830pF @ 30V
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  • EPC2050
    TRANS GAN BUMPED DIE
    EPC
    • Manufacturer: EPC
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  • EPC2039
    GANFET TRANS 80V BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 80V
    • Current - Continuous Drain (Id) @ 25°C: 6.8A (Ta)
    • Rds On (Max) @ Id, Vgs: 25mOhm @ 6A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 2mA
    • Gate Charge (Qg) (Max) @ Vgs: 2.4nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 210pF @ 40V
    • Technology: GaNFET (Gallium Nitride)
    • Drive Voltage (Max Rds On, Min Rds On): 5V
    • Vgs (Max): +6V, -4V
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  • EPC2010
    GANFET TRANS 200V 12A BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 125°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 200V
    • Current - Continuous Drain (Id) @ 25°C: 12A (Ta)
    • Rds On (Max) @ Id, Vgs: 25mOhm @ 6A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 3mA
    • Gate Charge (Qg) (Max) @ Vgs: 7.5nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 540pF @ 100V
    • Technology: GaNFET (Gallium Nitride)
    • Drive Voltage (Max Rds On, Min Rds On): 5V
    • Vgs (Max): +6V, -4V
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  • EPC2023
    GANFET TRANS 30V 60A BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 30V
    • Current - Continuous Drain (Id) @ 25°C: 60A (Ta)
    • Rds On (Max) @ Id, Vgs: 1.3mOhm @ 40A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 20mA
    • Input Capacitance (Ciss) (Max) @ Vds: 2300pF @ 15V
    • Technology: GaNFET (Gallium Nitride)
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  • EPC2101ENGRT
    GAN TRANS ASYMMETRICAL HALF BRID
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: 2 N-Channel (Half Bridge)
    • FET Feature: GaNFET (Gallium Nitride)
    • Drain to Source Voltage (Vdss): 60V
    • Current - Continuous Drain (Id) @ 25°C: 9.5A, 38A
    • Rds On (Max) @ Id, Vgs: 11.5mOhm @ 20A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 2mA
    • Gate Charge (Qg) (Max) @ Vgs: 2.7nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 300pF @ 30V
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  • EPC2001C
    GANFET TRANS 100V 36A BUMPED DIE
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Operating Temperature: -40°C ~ 150°C (TJ)
    • Package / Case: Die
    • Supplier Device Package: Die Outline (11-Solder Bar)
    • FET Type: N-Channel
    • Drain to Source Voltage (Vdss): 100V
    • Current - Continuous Drain (Id) @ 25°C: 36A (Ta)
    • Rds On (Max) @ Id, Vgs: 7mOhm @ 25A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 5mA
    • Gate Charge (Qg) (Max) @ Vgs: 9nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 900pF @ 50V
    • Technology: GaNFET (Gallium Nitride)
    • Drive Voltage (Max Rds On, Min Rds On): 5V
    • Vgs (Max): +6V, -4V
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  • EPC2103ENGRT
    GANFET TRANS SYM HALF BRDG 80V
    EPC
    • Manufacturer: EPC
    • Series: eGaN®
    • Mounting Type: Surface Mount
    • Package / Case: Die
    • Supplier Device Package: Die
    • FET Type: 2 N-Channel (Half Bridge)
    • FET Feature: GaNFET (Gallium Nitride)
    • Drain to Source Voltage (Vdss): 80V
    • Current - Continuous Drain (Id) @ 25°C: 23A
    • Rds On (Max) @ Id, Vgs: 5.5mOhm @ 20A, 5V
    • Vgs(th) (Max) @ Id: 2.5V @ 7mA
    • Gate Charge (Qg) (Max) @ Vgs: 6.5nC @ 5V
    • Input Capacitance (Ciss) (Max) @ Vds: 7600pF @ 40V
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