- Embedded - Microcontrollers 102064
- Embedded - Microprocessors 7562
- Embedded - FPGAs (Field Programmable Gate Array) 29783
- Embedded - CPLDs (Complex Programmable Logic Devices) 5616
- Embedded - System On Chip (SoC) 3809
- Embedded - DSP (Digital Signal Processors) 4396
- Embedded - Microcontroller, Microprocessor, FPGA Modules 1413
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- Voltage - Supply
- Operating Temperature
- Supplier Device Package
- Core Processor
- Speed
- Programmable Type
- Module/Board Type
- Number of I/O
- Number of Cores/Bus Width
- Voltage - Supply (Vcc/Vdd)
- Core Size
- Peripherals
- Primary Attributes
- Architecture
- Flash Size
- RAM Size
- Connectivity
- Number of LABs/CLBs
- Number of Macrocells
- Delay Time tpd(1) Max
- Program Memory Size
- Program Memory Type
- Controller Series
- Ethernet
- USB
- EEPROM Size
- Voltage Supply - Internal
- Clock Rate
- Co-Processor
- Non-Volatile Memory
- Co-Processors/DSP
- On-Chip RAM
- RAM Controllers
- Graphics Acceleration
- Voltage - I/O
- Voltage - Core
- Data Converters
- Oscillator Type
- Number of Logic Elements/Blocks
- Number of Gates
- Display & Interface Controllers
- SATA
- Security Features
- Number of Logic Elements/Cells
- Total RAM Bits
- Series
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- Manufacturer: Lattice Semiconductor Corporation
- Series: ispMACH® 4A
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 44-TQFP
- Supplier Device Package: 44-TQFP (10x10)
- Number of I/O: 32
- Programmable Type: In System Programmable
- Delay Time tpd(1) Max: 10ns
- Voltage Supply - Internal: 4.75V ~ 5.25V
- Number of Macrocells: 32
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- Manufacturer: Intel
- Series: Stratix® III E
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 780-BBGA, FCBGA
- Supplier Device Package: 780-FBGA (29x29)
- Voltage - Supply: 0.86V ~ 1.15V
- Number of I/O: 488
- Number of LABs/CLBs: 1900
- Number of Logic Elements/Cells: 47500
- Total RAM Bits: 5760000
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- Manufacturer: AMD Xilinx
- Series: XC4000E/X
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
- Voltage - Supply: 4.75V ~ 5.25V
- Number of I/O: 112
- Number of Gates: 5000
- Number of LABs/CLBs: 196
- Number of Logic Elements/Cells: 466
- Total RAM Bits: 6272
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- Manufacturer: Renesas Electronics America Inc
- Series: 78K0R/Kx3
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 100-LQFP
- Speed: 20MHz
- Core Size: 16-Bit
- Core Processor: 78K/0R
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 83
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: 3-Wire SIO, I²C, LINbus, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 16x10b; D/A 2x8b
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- Manufacturer: Texas Instruments
- Series: MSP430F6xx
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
- Speed: 25MHz
- Core Size: 16-Bit
- Core Processor: MSP430 CPUXV2
- Program Memory Type: FLASH
- RAM Size: 32K x 8
- Number of I/O: 62
- Peripherals: Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT, 7x24b Sigma Delta Converter
- Connectivity: I²C, IrDA, LINbus, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
- Program Memory Size: 512KB (512K x 8)
- Data Converters: A/D 8x10b
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- Manufacturer: Renesas Electronics America
- Series: RL78/G14
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 44-LQFP
- Supplier Device Package: 44-LQFP (10x10)
- Speed: 32MHz
- Core Size: 16-Bit
- Core Processor: RL78
- Program Memory Type: FLASH
- RAM Size: 24K x 8
- Number of I/O: 31
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: CSI, I²C, LINbus, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.6V ~ 5.5V
- EEPROM Size: 8K x 8
- Program Memory Size: 256KB (256K x 8)
- Data Converters: A/D 10x8/10b; D/A 2x8b
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- Manufacturer: Microchip Technology
- Series: MX
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 160-BQFP
- Supplier Device Package: 160-PQFP (28x28)
- Voltage - Supply: 3V ~ 3.6V, 4.75V ~ 5.25V
- Number of I/O: 125
- Number of Gates: 24000
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- Manufacturer: Texas Instruments
- Series: TMS320DM3x, DaVinci™
- Type: Digital Media System-on-Chip (DMSoC)
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TC)
- Package / Case: 337-LFBGA
- Supplier Device Package: 337-BGA (13x13)
- Interface: ASP, I²C, SPI, UART, USB
- Clock Rate: 270MHz
- Non-Volatile Memory: ROM (8kB)
- On-Chip RAM: 56kB
- Voltage - I/O: 1.8V, 3.3V
- Voltage - Core: 1.30V
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- Manufacturer: Fairchild Semiconductor
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 8-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package: 8-TSSOP
- Speed: 4MHz
- Core Size: 8-Bit
- Core Processor: ACE8001
- Program Memory Type: EEPROM
- RAM Size: 64 x 8
- Number of I/O: 6
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Oscillator Type: External, Internal
- Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
- EEPROM Size: 64 x 8
- Program Memory Size: 1KB (1K x 8)
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- Manufacturer: Analog Devices Inc.
- Series: SHARC®
- Type: Floating Point
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TC)
- Package / Case: 196-BGA, CSPBGA
- Supplier Device Package: 196-CSPBGA (15x15)
- Interface: Host Interface, Serial Port
- Clock Rate: 60MHz
- Non-Volatile Memory: External
- On-Chip RAM: 64kB
- Voltage - I/O: 3.30V
- Voltage - Core: 3.30V
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- Manufacturer: Microsemi Corporation
- Series: ProASIC3
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 100-TQFP
- Supplier Device Package: 100-VQFP (14x14)
- Voltage - Supply: 1.425V ~ 1.575V
- Number of I/O: 71
- Total RAM Bits: 36864
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
- Speed: 80MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
- Primary Attributes: ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
- Flash Size: 512KB
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- Manufacturer: Microchip Technology
- Series: AVR® ATmega
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-TQFP
- Supplier Device Package: 64-TQFP (14x14)
- Speed: 20MHz
- Core Size: 8-Bit
- Core Processor: AVR
- Program Memory Type: FLASH
- RAM Size: 2K x 8
- Number of I/O: 54
- Peripherals: Brown-out Detect/Reset, LCD, POR, PWM, WDT
- Connectivity: SPI, UART/USART, USI
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
- EEPROM Size: 1K x 8
- Program Memory Size: 32KB (16K x 16)
- Data Converters: A/D 8x10b
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- Manufacturer: Microchip Technology
- Series: PolarFire™
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
- Core Processor: RISC-V
- RAM Size: 1.4125MB
- Architecture: MPU, FPGA
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 161K Logic Modules
- Flash Size: 128KB
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- Manufacturer: Microchip Technology
- Series: PIC® 16F
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 18-SOIC (0.295", 7.50mm Width)
- Supplier Device Package: 18-SOIC
- Speed: 4MHz
- Core Size: 8-Bit
- Core Processor: PIC
- Program Memory Type: FLASH
- RAM Size: 224 x 8
- Number of I/O: 16
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Connectivity: UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2V ~ 5.5V
- EEPROM Size: 128 x 8
- Program Memory Size: 3.5KB (2K x 14)
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