- Embedded - Microcontrollers 102064
- Embedded - Microprocessors 7562
- Embedded - FPGAs (Field Programmable Gate Array) 29783
- Embedded - CPLDs (Complex Programmable Logic Devices) 5616
- Embedded - System On Chip (SoC) 3809
- Embedded - DSP (Digital Signal Processors) 4396
- Embedded - Microcontroller, Microprocessor, FPGA Modules 1413
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- Voltage - Supply
- Operating Temperature
- Supplier Device Package
- Core Processor
- Speed
- Programmable Type
- Module/Board Type
- Number of I/O
- Number of Cores/Bus Width
- Voltage - Supply (Vcc/Vdd)
- Core Size
- Peripherals
- Primary Attributes
- Architecture
- Flash Size
- RAM Size
- Connectivity
- Number of LABs/CLBs
- Number of Macrocells
- Delay Time tpd(1) Max
- Program Memory Size
- Program Memory Type
- Controller Series
- Ethernet
- USB
- EEPROM Size
- Voltage Supply - Internal
- Clock Rate
- Co-Processor
- Non-Volatile Memory
- Co-Processors/DSP
- On-Chip RAM
- RAM Controllers
- Graphics Acceleration
- Voltage - I/O
- Voltage - Core
- Data Converters
- Oscillator Type
- Number of Logic Elements/Blocks
- Number of Gates
- Display & Interface Controllers
- SATA
- Security Features
- Number of Logic Elements/Cells
- Total RAM Bits
- Series
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- Manufacturer: Microchip Technology
- Series: AVR® DB
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-VQFN (9x9)
- Speed: 24MHz
- Core Size: 8-Bit
- Core Processor: AVR
- Program Memory Type: FLASH
- RAM Size: 8K x 8
- Number of I/O: 54
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Connectivity: I²C, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
- EEPROM Size: 512 x 8
- Program Memory Size: 64KB (64K x 8)
- Data Converters: A/D 22x12b; D/A 1x10b
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- Manufacturer: Microchip Technology
- Series: PIC® XLP™ 18K
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 125°C (TA)
- Package / Case: 44-VQFN Exposed Pad
- Supplier Device Package: 44-QFN (8x8)
- Speed: 48MHz
- Core Size: 8-Bit
- Core Processor: PIC
- Program Memory Type: FLASH
- RAM Size: 1.5K x 8
- Number of I/O: 35
- Peripherals: Brown-out Detect/Reset, HLVD, POR, PWM, WDT
- Connectivity: I²C, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 2.3V ~ 5.5V
- EEPROM Size: 256 x 8
- Program Memory Size: 32KB (16K x 16)
- Data Converters: A/D 30x10b
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- Manufacturer: Cypress Semiconductor Corp
- Mounting Type: Surface Mount
- Package / Case: 120-LQFP
- Supplier Device Package: 120-LQFP (16x16)
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- Manufacturer: Intel
- Series: Arria 10 GX
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA (35x35)
- Voltage - Supply: 0.87V ~ 0.98V
- Number of I/O: 384
- Number of LABs/CLBs: 101620
- Number of Logic Elements/Cells: 270000
- Total RAM Bits: 17870848
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- Manufacturer: NXP USA Inc.
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 90°C (TA)
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: 32-HVQFN (5x5)
- Applications: Authentication
- Voltage - Supply: 1.62V ~ 5.5V
- Interface: I²C
- Core Processor: MX51
- Program Memory Type: EEPROM (76.4kB)
- Controller Series: A700x
- RAM Size: 3.2kB
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- Manufacturer: Intel
- Series: Stratix® IV GX
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA (40x40)
- Voltage - Supply: 0.87V ~ 0.93V
- Number of I/O: 744
- Number of LABs/CLBs: 11648
- Number of Logic Elements/Cells: 291200
- Total RAM Bits: 17661952
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- Manufacturer: STMicroelectronics
- Series: STM32F7
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 201-UFBGA
- Supplier Device Package: 176+25UFBGA (10x10)
- Speed: 216MHz
- Core Size: 32-Bit Single-Core
- Core Processor: ARM® Cortex®-M7
- Program Memory Type: FLASH
- RAM Size: 320K x 8
- Number of I/O: 140
- Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SAI, SD, SPDIF-Rx, SPI, UART/USART, USB OTG
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
- Program Memory Size: 512KB (512K x 8)
- Data Converters: A/D 24x12b; D/A 2x12b
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- Manufacturer: Rochester Electronics, LLC
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- Manufacturer: Microchip Technology
- Series: PIC® 16C
- Mounting Type: Through Hole
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 18-DIP (0.300", 7.62mm)
- Supplier Device Package: 18-PDIP
- Speed: 20MHz
- Core Size: 8-Bit
- Core Processor: PIC
- Program Memory Type: OTP
- RAM Size: 25 x 8
- Number of I/O: 12
- Peripherals: POR, WDT
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Program Memory Size: 768B (512 x 12)
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- Manufacturer: Renesas Electronics America Inc
- Series: RH850/F1L
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-LFQFP (20x20)
- Speed: 96MHz
- Core Size: 32-Bit Single-Core
- Core Processor: RH850G3K
- Program Memory Type: FLASH
- RAM Size: 160K x 8
- Number of I/O: 120
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: CANbus, CSI, I²C, LINbus, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- EEPROM Size: 64K x 8
- Program Memory Size: 1.5MB (1.5M x 8)
- Data Converters: A/D 24x12b, 24x10b
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- Manufacturer: AMD Xilinx
- Series: Versal™ AI Core
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
- Speed: 400MHz, 1GHz
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- RAM Size: 256KB
- Architecture: MPU, FPGA
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
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- Manufacturer: Renesas Electronics America Inc
- Series: 78K0R/Kx3-L
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 64-TQFP
- Speed: 20MHz
- Core Size: 16-Bit
- Core Processor: 78K/0R
- Program Memory Type: FLASH
- RAM Size: 2K x 8
- Number of I/O: 50
- Peripherals: DMA, LVD, POR, PWM, WDT
- Connectivity: 3-Wire SIO, I²C, LINbus, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
- Program Memory Size: 48KB (48K x 8)
- Data Converters: A/D 12x10b
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- Manufacturer: Intel
- Series: Cyclone® III
- Mounting Type: Surface Mount
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FBGA (23x23)
- Voltage - Supply: 1.15V ~ 1.25V
- Number of I/O: 278
- Number of LABs/CLBs: 6278
- Number of Logic Elements/Cells: 100448
- Total RAM Bits: 4451328
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- Manufacturer: Microchip Technology
- Series: AVR® XMEGA® D3
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 64-VFQFN Exposed Pad
- Supplier Device Package: 64-QFN (9x9)
- Speed: 32MHz
- Core Size: 8/16-Bit
- Core Processor: AVR
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 50
- Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
- Connectivity: I²C, IrDA, SPI, UART/USART
- Oscillator Type: Internal
- Voltage - Supply (Vcc/Vdd): 1.6V ~ 3.6V
- EEPROM Size: 1K x 8
- Program Memory Size: 32KB (16K x 16)
- Data Converters: A/D 16x12b
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- Manufacturer: Cypress Semiconductor Corp
- Series: F²MC-16LX MB90595G
- Mounting Type: Surface Mount
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 100-BQFP
- Supplier Device Package: 100-QFP (14x20)
- Speed: 16MHz
- Core Size: 16-Bit
- Core Processor: F²MC-16LX
- Program Memory Type: FLASH
- RAM Size: 4K x 8
- Number of I/O: 78
- Peripherals: POR, PWM, WDT
- Connectivity: CANbus, EBI/EMI, SCI, Serial I/O, UART/USART
- Oscillator Type: External
- Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
- Program Memory Size: 128KB (128K x 8)
- Data Converters: A/D 8x8/10b
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- Offers in stock:
- 10
- 15
- 50
- 100