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- Architecture
- Flash Size
- RAM Size
- Connectivity
- Series
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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- Manufacturer: AMD Xilinx
- Series: Automotive, AEC-Q100, Zynq®-7000 XA
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 400-LFBGA, CSPBGA
- Supplier Device Package: 400-CSPBGA (17x17)
- Speed: 667MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Artix™-7 FPGA, 85K Logic Cells
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- Manufacturer: AMD Xilinx
- Series: Versal™ AI Core
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
- Speed: 400MHz, 1GHz
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- RAM Size: 256KB
- Architecture: MPU, FPGA
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Versal™ AI Core FPGA, 1.5M Logic Cells
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 144-LQFP
- Supplier Device Package: 144-TQFP (20x20)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 5K Logic Modules
- Flash Size: 128KB
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BFBGA
- Supplier Device Package: 484-FBGA (19x19)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 150K Logic Modules
- Flash Size: 512KB
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 1650K Logic Elements
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- Manufacturer: AMD Xilinx
- Series: Zynq®-7000
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
- Speed: 667MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Kintex™-7 FPGA, 350K Logic Cells
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LBGA
- Supplier Device Package: 256-FPBGA (17x17)
- Speed: 80MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
- Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size: 256KB
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- Manufacturer: Microchip Technology
- Series: PolarFire™
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 536-LFBGA, CSPBGA
- Supplier Device Package: 536-LFBGA
- Core Processor: RISC-V
- RAM Size: 2.2MB
- Architecture: MPU, FPGA
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 254K Logic Modules
- Flash Size: 128KB
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-VFBGA (17x17)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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- Manufacturer: AMD Xilinx
- Series: Versal™ AI Core
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2197-BFBGA, FCBGA
- Supplier Device Package: 2197-FCBGA (45x45)
- Speed: 600MHz, 1.3GHz
- Core Processor: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
- RAM Size: 256KB
- Architecture: MPU, FPGA
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Versal™ AI Core FPGA, 1.9M Logic Cells
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 25K Logic Modules
- Flash Size: 256KB
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- Manufacturer: AMD Xilinx
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 530-WFBGA, FCBGA
- Supplier Device Package: 530-FCBGA (16x9.5)
- Speed: 533MHz, 1.3GHz
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MPU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
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- Manufacturer: Broadcom Limited
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- Offers in stock:
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