Embedded - System On Chip (SoC) | Embedded IC's | IC's

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Found: 3809

A2F200M3F-FGG484I

IC SOC CORTEX-M3 80MHZ 484FBGA

Microsemi Corporation
- Manufacturer: Microsemi Corporation
- Series: SmartFusion®
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 80MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART
- Primary Attributes: ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
- Flash Size: 256KB
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5ASXFB5H4F40C4G

IC SOC CORTEX-A9 925MHZ 1517FBGA

Intel
- Manufacturer: Intel
- Series: Arria V SX
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA, FC (40x40)
- Speed: 925MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 462K Logic Elements
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M2S050T-FCS325

IC SOC CORTEX-M3 166MHZ 325BGA

Microchip Technology
- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 325-TFBGA, FCBGA
- Supplier Device Package: 325-FCBGA (11x11)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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1SX280HU2F50E1VGS3

IC FPGA STRATIX 10 2397FBGA

Intel
- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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M2S025TS-1VF256I

IC SOC CORTEX-M3 166MHZ 256FBGA

Microchip Technology
- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 256-LFBGA
- Supplier Device Package: 256-FPBGA (14x14)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 25K Logic Modules
- Flash Size: 256KB
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1SX250HH3F55I3VG

IC FPGA STRATIX 10 2912FBGA

Intel
- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2500K Logic Elements
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MPFS250TS-1FCVG784I

MPFS250TS-1FCVG784I

Microchip Technology
- Manufacturer: Microchip Technology
- Series: PolarFire™
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
- Core Processor: RISC-V
- RAM Size: 2.2MB
- Architecture: MPU, FPGA
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 254K Logic Modules
- Flash Size: 128KB
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XCZU3CG-1SBVA484I

IC SOC CORTEX-A53 484FCBGA

AMD Xilinx
- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC CG
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
- Speed: 500MHz, 1.2GHz
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
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10AS032H1F35E1SG

IC SOC CORTEX-A9 1.5GHZ 1152FBGA

Intel
- Manufacturer: Intel
- Series: Arria 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA, FC (35x35)
- Speed: 1.5GHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 320K Logic Elements
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5ASXMB5G4F40I5N

IC SOC CORTEX-A9 800MHZ 1517FBGA

Intel
- Manufacturer: Intel
- Series: Arria V SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA, FC (40x40)
- Speed: 800MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 462K Logic Elements
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XCZU47DR-L1FSVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

AMD Xilinx
- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ RFSoC
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
- Speed: 500MHz, 1.2GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
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M2S090TS-FG676

IC SOC CORTEX-M3 166MHZ 676FBGA

Microsemi Corporation
- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 90K Logic Modules
- Flash Size: 512KB
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XCZU7CG-1FBVB900I

IC SOC CORTEX-A53 900FCBGA

AMD Xilinx
- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC CG
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
- Speed: 500MHz, 1.2GHz
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
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M2S050T-1FGG484

IC SOC CORTEX-M3 166MHZ 484FBGA

Microchip Technology
- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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XC7Z030-1FFG676C

IC SOC CORTEX-A9 667MHZ 676FCBGA

AMD Xilinx
- Manufacturer: AMD Xilinx
- Series: Zynq®-7000
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BBGA, FCBGA
- Supplier Device Package: 676-FCBGA (27x27)
- Speed: 667MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Kintex™-7 FPGA, 125K Logic Cells
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