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- Architecture
- Flash Size
- RAM Size
- Connectivity
- Series
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-VFBGA (17x17)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Intel
- Series: Arria V ST
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA, FC (40x40)
- Speed: 800MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 462K Logic Elements
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- Manufacturer: Microchip Technology
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 325-LFBGA
- Supplier Device Package: 325-LFBGA (11x14.5)
- Core Processor: RISC-V
- RAM Size: 857.6kB
- Architecture: MPU, FPGA
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 93K Logic Modules
- Flash Size: 128KB
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 256-LFBGA
- Supplier Device Package: 256-FPBGA (14x14)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 10K Logic Modules
- Flash Size: 256KB
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC EV
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1156-BBGA, FCBGA
- Supplier Device Package: 1156-FCBGA (35x35)
- Speed: 500MHz, 600MHz, 1.2GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 60K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microchip Technology
- Series: PolarFire™
- Operating Temperature: 0°C ~ 100°C
- Package / Case: 484-BFBGA, FCBGA
- Supplier Device Package: 484-FCBGA (19x19)
- Core Processor: RISC-V
- RAM Size: 857.6kB
- Architecture: MPU, FPGA
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 93K Logic Modules
- Flash Size: 128KB
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 10K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Intel
- Series: Arria V SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FBGA, FC (40x40)
- Speed: 800MHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 462K Logic Elements
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 400-LFBGA
- Supplier Device Package: 400-VFBGA (17x17)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 25K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 60K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BFBGA
- Supplier Device Package: 484-FBGA (19x19)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 150K Logic Modules
- Flash Size: 512KB
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ RFSoC
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
- Speed: 533MHz, 1.333GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DDR, DMA, PCIe
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 930K+ Logic Cells
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 325-TFBGA, CSPBGA
- Supplier Device Package: 325-CSPBGA (11x11)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 60K Logic Modules
- Flash Size: 256KB
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- Offers in stock:
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