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- Architecture
- Flash Size
- RAM Size
- Connectivity
- Series
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 325-TFBGA, FCBGA
- Supplier Device Package: 325-FCBGA (11x13.5)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 90K Logic Modules
- Flash Size: 512KB
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 325-TFBGA, CSPBGA
- Supplier Device Package: 325-CSPBGA (11x11)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 325-TFBGA, FCBGA
- Supplier Device Package: 325-FCBGA (11x11)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 25K Logic Modules
- Flash Size: 256KB
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC CG
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 900-BBGA, FCBGA
- Supplier Device Package: 900-FCBGA (31x31)
- Speed: 500MHz, 1.2GHz
- Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC EG
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FCBGA (42.5x42.5)
- Speed: 533MHz, 600MHz, 1.3GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 926K+ Logic Cells
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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- Manufacturer: AMD Xilinx
- Series: Zynq® UltraScale+™ MPSoC EG
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1517-BBGA, FCBGA
- Supplier Device Package: 1517-FCBGA (40x40)
- Speed: 500MHz, 600MHz, 1.2GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 325-TFBGA, CSPBGA
- Supplier Device Package: 325-CSPBGA (11x11)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 90K Logic Modules
- Flash Size: 512KB
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 2912-BBGA, FCBGA
- Supplier Device Package: 2912-FBGA, FC (55x55)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2500K Logic Elements
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 2397-BBGA, FCBGA
- Supplier Device Package: 2397-FBGA, FC (50x50)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2500K Logic Elements
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- Manufacturer: Microsemi Corporation
- Series: SmartFusion®2
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 896-BGA
- Supplier Device Package: 896-FBGA (31x31)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 50K Logic Modules
- Flash Size: 256KB
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- Manufacturer: Intel
- Series: Stratix® 10 SX
- Operating Temperature: 0°C ~ 100°C (TJ)
- Package / Case: 1760-BBGA, FCBGA
- Supplier Device Package: 1760-FBGA (42.5x42.5)
- Speed: 1.5GHz
- Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 2800K Logic Elements
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- Manufacturer: Intel
- Series: Arria 10 SX
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FBGA, FC (35x35)
- Speed: 1.5GHz
- Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
- RAM Size: 256KB
- Architecture: MCU, FPGA
- Peripherals: DMA, POR, WDT
- Connectivity: EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
- Primary Attributes: FPGA - 480K Logic Elements
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- Manufacturer: Microchip Technology
- Series: SmartFusion®2
- Operating Temperature: -40°C ~ 100°C (TJ)
- Package / Case: 484-BGA
- Supplier Device Package: 484-FPBGA (23x23)
- Speed: 166MHz
- Core Processor: ARM® Cortex®-M3
- RAM Size: 64KB
- Architecture: MCU, FPGA
- Peripherals: DDR
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Primary Attributes: FPGA - 5K Logic Modules
- Flash Size: 128KB
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- Offers in stock:
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