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- USB
- Co-Processors/DSP
- RAM Controllers
- Graphics Acceleration
- Voltage - I/O
- Display & Interface Controllers
- SATA
- Security Features
- Series
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- Manufacturer: NXP USA Inc.
- Series: MPC86xx
- Operating Temperature: 0°C ~ 105°C (TA)
- Package / Case: 994-BCBGA, FCCBGA
- Supplier Device Package: 994-FCCBGA (33x33)
- Speed: 1.067GHz
- Core Processor: PowerPC e600
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Ethernet: 10/100/1000Mbps (4)
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- Manufacturer: NXP USA Inc.
- Series: MPC8xx
- Operating Temperature: 0°C ~ 95°C (TA)
- Package / Case: 357-BBGA
- Supplier Device Package: 357-PBGA (25x25)
- Speed: 100MHz
- Core Processor: MPC8xx
- Voltage - I/O: 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Ethernet: 10Mbps (4), 10/100Mbps (1)
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- Manufacturer: NXP USA Inc.
- Series: QorIQ P1
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 425-FBGA
- Supplier Device Package: 425-TEPBGA I (19x19)
- Speed: 800MHz
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Ethernet: 10/100/1000Mbps (2)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (1)
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- Manufacturer: NXP USA Inc.
- Series: QorlQ LS1
- Operating Temperature: 0°C ~ 105°C (TA)
- Package / Case: 780-BFBGA
- Supplier Device Package: 780-FBGA (23x23)
- Speed: 1.4GHz
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 8 Core, 64-Bit
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: DDR4
- Graphics Acceleration: Yes
- Display & Interface Controllers: LVDS
- Ethernet: 10GbE (2), 1GbE (8)
- SATA: SATA 6Gbps (1)
- USB: USB 3.0 + PHY (2)
- Security Features: Secure Boot, TrustZone®
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- Manufacturer: NXP USA Inc.
- Series: M683xx
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-FQFP (32x32)
- Speed: 25MHz
- Core Processor: CPU32
- Voltage - I/O: 5.0V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Ethernet: 10Mbps (1)
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- Manufacturer: Rochester Electronics, LLC
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- Manufacturer: NXP USA Inc.
- Series: i.MX6S
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 624-LFBGA
- Supplier Device Package: 624-MAPBGA (21x21)
- Speed: 1GHz
- Core Processor: ARM® Cortex®-A9
- Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, LVDDR3, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100/1000Mbps (1)
- USB: USB 2.0 + PHY (4)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
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- Manufacturer: NXP USA Inc.
- Series: QorIQ T2
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 780-FBGA, FCBGA
- Supplier Device Package: 780-FCPBGA (23x23)
- Speed: 1.8GHz
- Core Processor: PowerPC e6500
- Number of Cores/Bus Width: 4 Core, 64-Bit
- RAM Controllers: DDR3, DDR3L
- Graphics Acceleration: No
- Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Volatile key Storage
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- Manufacturer: NXP USA Inc.
- Series: MPC82xx
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 480-LBGA Exposed Pad
- Supplier Device Package: 480-TBGA (37.5x37.5)
- Speed: 200MHz
- Core Processor: PowerPC G2
- Voltage - I/O: 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM, SDRAM
- Graphics Acceleration: No
- Ethernet: 10/100Mbps (3)
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- Manufacturer: NXP USA Inc.
- Series: i.MX53
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 529-FBGA
- Supplier Device Package: 529-TEPBGA (19x19)
- Speed: 800MHz
- Core Processor: ARM® Cortex®-A8
- Voltage - I/O: 1.3V, 1.8V, 2.775V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR2, DDR2, DDR3
- Graphics Acceleration: Yes
- Display & Interface Controllers: Keypad, LCD
- Ethernet: 10/100Mbps (1)
- SATA: SATA 1.5Gbps (1)
- USB: USB 2.0 (2), USB 2.0 + PHY (2)
- Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
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- Manufacturer: Rochester Electronics, LLC
- Series: Sitara™
- Operating Temperature: -40°C ~ 90°C (TJ)
- Package / Case: 361-LFBGA
- Supplier Device Package: 361-NFBGA (16x16)
- Speed: 300MHz
- Core Processor: ARM926EJ-S
- Voltage - I/O: 1.8V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: System Control; CP15
- RAM Controllers: LPDDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: 10/100Mbps (1)
- USB: USB 2.0 + PHY (1)
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- Manufacturer: Intel
- Series: i960
- Operating Temperature: 0°C ~ 100°C (TC)
- Package / Case: 132-BQFP Bumpered
- Supplier Device Package: 132-QFP
- Speed: 33MHz
- Core Processor: i960
- Voltage - I/O: 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Graphics Acceleration: No
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- Manufacturer: Rochester Electronics, LLC
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- Manufacturer: Advantech Corp
- Series: Ivy Bridge
- Package / Case: 2011-LGA Module
- Supplier Device Package: 2011-LGA
- Speed: 2.0GHz
- Core Processor: Xeon E5-2618L v2
- Number of Cores/Bus Width: 6 Core, 64-Bit
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- Manufacturer: NXP USA Inc.
- Series: QorIQ® Layerscape
- Operating Temperature: -40°C ~ 105°C
- Package / Case: 211-VFLGA
- Supplier Device Package: 211-FCLGA (9.6x9.6)
- Speed: 600MHz
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 1 Core, 64-Bit
- RAM Controllers: DDR3L
- Ethernet: GbE (2)
- SATA: SATA 6Gbps (1)
- USB: USB 2.0 (1), USB 3.0 + PHY
- Security Features: Secure Boot, TrustZone®
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- Offers in stock:
- 10
- 15
- 50
- 100