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- USB
- Co-Processors/DSP
- RAM Controllers
- Graphics Acceleration
- Voltage - I/O
- Display & Interface Controllers
- SATA
- Security Features
- Series
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- Manufacturer: Rochester Electronics, LLC
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- Manufacturer: Advantech Corp
- Series: Broadwell
- Package / Case: 2011-LGA Module
- Supplier Device Package: 2011-LGA
- Speed: 2.2GHz
- Core Processor: Xeon E5-2618L v4
- Number of Cores/Bus Width: 10 Core, 64-Bit
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- Manufacturer: NXP USA Inc.
- Series: M683xx
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 100-LQFP
- Supplier Device Package: 100-LQFP (14x14)
- Speed: 16MHz
- Core Processor: M68000
- Voltage - I/O: 5.0V
- Number of Cores/Bus Width: 1 Core, 8/16-Bit
- Co-Processors/DSP: Communications; RISC CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
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- Manufacturer: NXP USA Inc.
- Series: MPC83xx
- Operating Temperature: 0°C ~ 105°C (TA)
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
- Speed: 333MHz
- Core Processor: PowerPC e300c2
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Ethernet: 10/100Mbps (3)
- USB: USB 2.0 (1)
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- Manufacturer: Rochester Electronics, LLC
- Operating Temperature: 0°C ~ 70°C
- Package / Case: 492-BBGA
- Supplier Device Package: 492-BGA (35x35)
- Speed: 266MHz
- Core Processor: Xscale
- Voltage - I/O: 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Ethernet: 10/100Mbps (2)
- USB: USB 1.1 (1)
- Security Features: Cryptography
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- Manufacturer: Rochester Electronics, LLC
- Series: SAM9M
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 324-TFBGA
- Supplier Device Package: 324-TFBGA (15x15)
- Speed: 400MHz
- Core Processor: ARM926EJ-S
- Voltage - I/O: 1.8V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- RAM Controllers: LPDDR, LPSDR, DDR2, SDR, SRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD, Touchscreen, Video Decoder
- Ethernet: 10/100Mbps
- USB: USB 2.0 (3)
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- Manufacturer: Microchip Technology
- Series: SAMA5D4
- Operating Temperature: -40°C ~ 85°C (TA)
- Package / Case: 361-TFBGA
- Supplier Device Package: 361-TFBGA (16x16)
- Speed: 600MHz
- Core Processor: ARM® Cortex®-A5
- Voltage - I/O: 1.2V, 1.8V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR, LPDDR2, DDR2
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, Touchscreen
- Ethernet: 10/100Mbps (1)
- USB: USB 2.0 (3)
- Security Features: AES, SHA, TDES, TRNG
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- Manufacturer: Rochester Electronics, LLC
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- Manufacturer: NXP USA Inc.
- Operating Temperature: -40°C ~ 105°C (TA)
- Package / Case: 621-FBGA, FCBGA
- Supplier Device Package: 621-FCPBGA (17x17)
- Speed: 800MHz
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4
- Voltage - I/O: 1V, 1.8V, 3.3V
- Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: DDR3, DDR3L, LPDDR2
- Graphics Acceleration: Yes
- Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
- Ethernet: 1Gbps
- Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
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- Manufacturer: NXP USA Inc.
- Series: MPC83xx
- Operating Temperature: 0°C ~ 105°C (TA)
- Package / Case: 516-BBGA
- Supplier Device Package: 516-FPBGA (27x27)
- Speed: 266MHz
- Core Processor: PowerPC e300c2
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Ethernet: 10/100Mbps (3)
- USB: USB 2.0 (1)
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- Manufacturer: NXP USA Inc.
- Series: M683xx
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 240-BFQFP
- Supplier Device Package: 240-FQFP (32x32)
- Speed: 25MHz
- Core Processor: CPU32
- Voltage - I/O: 5.0V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Ethernet: 10Mbps (1)
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- Manufacturer: NXP USA Inc.
- Series: i.MXL
- Operating Temperature: 0°C ~ 70°C (TA)
- Package / Case: 225-LFBGA
- Supplier Device Package: 225-MAPBGA (13x13)
- Speed: 150MHz
- Core Processor: ARM920T
- Voltage - I/O: 1.8V, 3.0V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- USB: USB 1.x (1)
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- Manufacturer: NXP USA Inc.
- Series: QorIQ T2
- Operating Temperature: 0°C ~ 105°C (TA)
- Package / Case: 896-BFBGA, FCBGA
- Supplier Device Package: 896-FCPBGA (25x25)
- Speed: 1.8GHz
- Core Processor: PowerPC e6500
- Number of Cores/Bus Width: 4 Core, 64-Bit
- RAM Controllers: DDR3, DDR3L
- Ethernet: 1Gbps (8), 2.5Gbps (4), 10Gbps (4)
- SATA: SATA 3Gbps (2)
- USB: USB 2.0 + PHY (2)
- Security Features: Boot Security, Cryptography, Secure Fusebox, Secure Debug, Tamper Detection, Volatile key Storage
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- Manufacturer: Texas Instruments
- Series: Sitara™
- Operating Temperature: -40°C ~ 105°C (TJ)
- Package / Case: 324-LFBGA
- Supplier Device Package: 324-NFBGA(15x15)
- Speed: 800MHz
- Core Processor: ARM® Cortex®-A8
- Voltage - I/O: 1.8V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: LPDDR, DDR2, DDR3, DDR3L
- Graphics Acceleration: Yes
- Display & Interface Controllers: LCD, Touchscreen
- Ethernet: 10/100/1000Mbps (2)
- USB: USB 2.0 + PHY (2)
- Security Features: Cryptography, Random Number Generator
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- Manufacturer: NXP USA Inc.
- Series: MPC83xx
- Operating Temperature: 0°C ~ 125°C (TA)
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
- Speed: 667MHz
- Core Processor: PowerPC e300c4s
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Number of Cores/Bus Width: 1 Core, 32-Bit
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Ethernet: 10/100/1000Mbps (2)
- SATA: SATA 3Gbps (4)
- USB: USB 2.0 + PHY (1)
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- Offers in stock:
- 10
- 15
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