• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±5.34%
• Voltage - Zener (Nom) (Vz): 6.55V
• Impedance (Max) (Zzt): 15 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 19.8V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 22V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
• Current - Reverse Leakage @ Vr: 500nA @ 62.2V
• Tolerance: ±5%
• Power - Max: 5W
• Voltage - Zener (Nom) (Vz): 82V
• Impedance (Max) (Zzt): 65 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 14.4V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 16V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
• Current - Reverse Leakage @ Vr: 500nA @ 56V
• Tolerance: ±5%
• Power - Max: 5W
• Voltage - Zener (Nom) (Vz): 75V
• Impedance (Max) (Zzt): 45 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 5µA @ 2V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 5.1V
• Impedance (Max) (Zzt): 17 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 9.9V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 13V
• Impedance (Max) (Zzt): 13 Ohms

• Manufacturer: SMC Diode Solutions
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 165°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 14.4V
• Tolerance: ±5%
• Power - Max: 3W
• Voltage - Zener (Nom) (Vz): 19V
• Impedance (Max) (Zzt): 13 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 75°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±5%
• Voltage - Zener (Nom) (Vz): 6.4V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: SMC Diode Solutions
• Mounting Type: Surface Mount
• Operating Temperature: -40°C ~ 165°C (TJ)
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.1V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 13.7V
• Tolerance: ±5%
• Power - Max: 3W
• Voltage - Zener (Nom) (Vz): 18V
• Impedance (Max) (Zzt): 12 Ohms