• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 29.7V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 39V
• Impedance (Max) (Zzt): 60 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 51.68V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 68V
• Impedance (Max) (Zzt): 700 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 7V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 9.1V
• Impedance (Max) (Zzt): 10 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±4.83%
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 10 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 100nA @ 21V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 27V
• Impedance (Max) (Zzt): 41 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 47.1V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 62V
• Impedance (Max) (Zzt): 125 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 42.6V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 56V
• Impedance (Max) (Zzt): 110 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 25.2V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 28V
• Impedance (Max) (Zzt): 100 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
• Current - Reverse Leakage @ Vr: 2µA @ 9.1V
• Tolerance: ±5%
• Power - Max: 5W
• Voltage - Zener (Nom) (Vz): 12V
• Impedance (Max) (Zzt): 2.5 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 12.2V
• Tolerance: ±5%
• Power - Max: 1W
• Voltage - Zener (Nom) (Vz): 16V
• Impedance (Max) (Zzt): 16 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 50V
• Current - Average Rectified (Io): 20mA
• Voltage - Forward (Vf) (Max) @ If: 880mV @ 20mA
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 50nA @ 50V
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Operating Temperature - Junction: -55°C ~ 175°C

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 6.2V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 8.2V