• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die
• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 40V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 600mV @ 1A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Current - Reverse Leakage @ Vr: 100µA @ 40V
• Operating Temperature - Junction: -55°C ~ 125°C

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 76V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 100V
• Impedance (Max) (Zzt): 500 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
• Current - Reverse Leakage @ Vr: 500nA @ 15.2V
• Tolerance: ±5%
• Power - Max: 5W
• Voltage - Zener (Nom) (Vz): 20V
• Impedance (Max) (Zzt): 3 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -55°C ~ 100°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±5%
• Voltage - Zener (Nom) (Vz): 6.4V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±4.83%
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 15 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 500nA @ 56V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 75V
• Impedance (Max) (Zzt): 270 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
• Current - Reverse Leakage @ Vr: 1µA @ 2V
• Tolerance: ±5%
• Power - Max: 5W
• Voltage - Zener (Nom) (Vz): 5.6V
• Impedance (Max) (Zzt): 1 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.2V @ 200mA
• Current - Reverse Leakage @ Vr: 100µA @ 1V
• Tolerance: ±5%
• Voltage - Zener (Nom) (Vz): 3.3V
• Impedance (Max) (Zzt): 10 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 5µA @ 4V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 6.2V
• Impedance (Max) (Zzt): 7 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 10nA @ 22.8V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 30V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Series: Military, MIL-PRF-19500/586
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die
• Diode Type: Schottky
• Voltage - DC Reverse (Vr) (Max): 20V
• Current - Average Rectified (Io): 1A
• Voltage - Forward (Vf) (Max) @ If: 600mV @ 1A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Current - Reverse Leakage @ Vr: 100µA @ 20V
• Operating Temperature - Junction: -55°C ~ 125°C

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 200°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 1A
• Current - Reverse Leakage @ Vr: 500nA @ 42.6V
• Tolerance: ±5%
• Power - Max: 5W
• Voltage - Zener (Nom) (Vz): 56V
• Impedance (Max) (Zzt): 35 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Voltage - Forward (Vf) (Max) @ If: 1.5V @ 200mA
• Current - Reverse Leakage @ Vr: 1µA @ 6.61V
• Tolerance: ±5%
• Power - Max: 500mW
• Voltage - Zener (Nom) (Vz): 8.7V
• Impedance (Max) (Zzt): 200 Ohms

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Package / Case: Die
• Supplier Device Package: Die
• Diode Type: Standard
• Voltage - DC Reverse (Vr) (Max): 100V
• Current - Average Rectified (Io): 3A
• Voltage - Forward (Vf) (Max) @ If: 875mV @ 4A
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 30ns
• Current - Reverse Leakage @ Vr: 5µA @ 100V
• Capacitance @ Vr, F: 60pF @ 10V, 1MHz
• Operating Temperature - Junction: -65°C ~ 175°C

• Manufacturer: Microchip Technology
• Mounting Type: Surface Mount
• Operating Temperature: -65°C ~ 175°C
• Package / Case: Die
• Supplier Device Package: Die
• Current - Reverse Leakage @ Vr: 2µA @ 3V
• Tolerance: ±5.34%
• Voltage - Zener (Nom) (Vz): 6.55V
• Impedance (Max) (Zzt): 15 Ohms